Kmw Inc

Jin Soo Yeo

Chang Woo Yoo

Duk Yong Kim

Min Sik Park

In-ho Kim

Hye Yeon Kim

Jun Woo Yang

Jae Hyun Park

Yong Hee Han

In Hwa Choi

Youn Jun Cho

Kyu Chul Choi

Jeong Hyun Choi

Kyo Sung Ji

Inho Kim

In Ho Kim

Min Seon Yun

Bae Mook Jeong

Seong Man Kang

Hyoung Seok Yang

Seong-man Kang

Dae-myung Park

Yoon Yong Kim

A clamping apparatus is provided. The clamping apparatus includes: an arm unit configured to be coupled to a support pole and has a mounting space formed in a tip portion thereof; and a rotation unit comprising a rotating block which is configured to be inserted into the mounting space of the arm unit and tilting unit installing stages provided at an opposite side of the rotating block, wherein the rotating block is configured to be detachably mounted in the mounting space of the arm unit and rotatable about a hinge point in the mounting space at a predetermined angle in a left-right direction. The rotating block comprises a mounting guide unit having an upper surface and a lower surface, and the mounting guide unit comprises a guide tube provided on the lower surface and configured to protrude from the lower surface to penetrate a hinge hole provided on a lower surface of the mounting space of the arm unit at a corresponding location of the hinge point.

Clamping apparatus for antenna

A heat dissipation device for an electronic element includes a first chamber containing a printed circuit board with heating elements, and a second chamber for heat exchange. The second chamber contains a refrigerant injection part and supply part. A heat transfer part between the chambers receives heat from the heating elements and transfers it to the second chamber. A condensing part condenses injected refrigerant. The heat transfer part has evaporation-inducing ribs on its surface exposed to the second chamber, allowing injected liquid refrigerant to be adsorbed and flow downward in a zigzag pattern. This configuration enables efficient heat dissipation through phase changes of the refrigerant as it evaporates and condenses. The device may also include features like specially-shaped condensation ribs, a blower part to improve condensation, and a pressure regulator for the second chamber. This design provides improved heat dissipation performance without increasing device size.

Heat dissipation device for electronic element

A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.

Cooling apparatus for electronic element

The present invention relates to a cooling device for an antenna apparatus. Particularly, the cooling device comprises a heat-dissipating cover which has an inner surface exposed to a thermal space and an outer surface exposed to the outside where outside air flows, and multiple wave heat-dissipating fins which are disposed in multiple rows on the outer surface of the heat-dissipating cover so as to be thermally conductive, and form curved surfaces that are continuous from the outer surface of the heat-dissipating cover to a discretionary height, in which the horizontal cross-sections at the discretionary height have straight-line shapes in which same are rotated by a predetermined angle in any one direction from the horizontal cross-sections on the outer surface of the heat-dissipating cover. Therefore, the present invention provides the advantage of enhancing heat-dissipating performance.

Cooling device for antenna apparatus

The present disclosure in at least one embodiment provides a wireless communication device support bracket, comprising a fixing unit configured to be fixed to the support pole, a main support unit extending from the fixing unit in a first direction, a sub-support unit extending from one end of the main support unit, and a connection unit rotatably connected to the sub-support unit about at least one rotation axis, the connection unit being configured to be connected with the wireless communication device.

Bracket for supporting wireless communication device and wireless communication device support assembly using same

The present invention relates to a clamping device for an antenna and, in particular, to a clamping device for an antenna which include: an arm unit coupled to a support pole and having a rotating shaft groove opening upward in a front end portion; a rotation unit detachably mounted in the rotating shaft hole of the arm unit and coupled to be rotatable at a predetermined angle in the left and right direction around the rotating shaft hole; and a tilting unit coupled to the front end portion of the rotation unit so as to be tiltable in the vertical direction while mediating coupling of an antenna device. Due to this feature, the clamping device for an antenna provides the advantages of eliminating spatial limitations on a plurality of antenna devices for the support pole and improving workability.

Clamping device for antenna

The present disclosure in at least one embodiment provides a wireless communication device, comprising a radome comprising a first locking unit and a sealing protrusion formed along at least one side end, a lower case formed along at least one side end and including a sealing protrusion groove which is configured to receive at least part of the sealing protrusion and a second locking unit, and a fastener which is fastened to the first locking unit and the second locking unit to fix the lower case and the radome.

Wireless communication device

The present invention relates to a clamping apparatus for an antenna. Particularly, the clamping apparatus comprises: an arm unit which is coupled to a support pole and has a mounting space formed in a tip portion thereof and open in a longitudinal direction; a rotation unit which is detachably mounted in the mounting space of the arm unit and has a tip portion coupled to be rotatable predetermined angle in the left and right directions with respect to a hinge point in the mounting space; a tilting unit which is coupled to the tip portion of the rotation unit so as to be tiltable in the up and down directions and mediates the coupling of an antenna device; and a mounting guide unit which is provided in the rotation unit, and is elastically pressed and then temporarily fixed to the hinge point of the mounting space when the rotation unit is mounted in the mounting space of the arm unit. Thus, the present invention provides the advantages of removing spatial limitations for a plurality of antenna devices with respect to the support pole, and improving workability.

An antenna apparatus is disclosed, including a lower housing, a middle housing disposed on the lower housing and having one surface formed with one or more first heat dissipation fins, a first accommodation space formed by the lower housing and the middle housing, at least one first heat-generating element disposed in the first accommodation space, one or more heat dissipation supports each disposed on the middle housing and having at least one surface formed with one or more second heat dissipation fins, and an antenna module supported on the one or more heat dissipation supports.

Antenna apparatus

Antenna supporter

A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.

A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe. The unit heat pipe includes one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.

The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

Multiple-input and multiple-output antenna appartus

The present disclosure relates to a multi input and multi output antenna apparatus. The multi input and multi output antenna apparatus may include: an antenna board having a plurality of antenna elements arranged on a front surface thereof; and a transmitting/receiving module board having a plurality of first heat generation elements provided on a front surface thereof and a plurality of second heat generation elements provided on a rear surface thereof, and disposed to have a separation space from the antenna board. The heat generated from the plurality of first heat generation elements may be radiated to the front of the transmitting/receiving module board, and the heat generated from the plurality of second heat generation elements may be radiated to the rear of the transmitting/receiving module board.

Growing community of inventors

Hwaseong-si, South Korea

Jin Soo Yeo