Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Jin-Song Feng

Cheng-Tien Lai

Yi Cheng Zhang

Wan-Lin Xia

Cui-Jun Lu

Wei-Le Wu

Tao Li

Guang Yu

Zhi-Yong Zhou

Hsieh Kun Lee

Hsieh-Kun Lee

Jie Liu

Xue-Wen Peng

Wen-Xiang Zhang

Jin Wang

Chun-Jiang Shuai

Bo-Yong Yang

Bao-Chun Chen

Song-Shui Liu

Qiao Chen

A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

Backboard assembly and electronic device having the same

An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

LED lamp including LED mounts with fin arrays

An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

Light-guiding module and LED light source using the same

An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

LED lamp

An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

Fixing device for heat sink

A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

Heat dissipation assembly

A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and a first spring clip secured at one side thereof. The locking device is pivotably connected to the retention module and includes a second spring clip attached thereon. The heat sink rests on the bottom wall of the retention module with an end thereof being pressed by the first spring clip, and an opposite end thereof being pressed by the second spring clip. The locking device can be at a released position where the locking device is pivotable, so that the heat sink is removable from the retention module, and a locked position where the locking device presses the base of the heat sink.

Heat dissipation device having a locking device

A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.

Heat dissipation device having a fixing base

A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The piercing body includes a piercing part piercing through the engaging part, and a latching part below the piercing part. The operating member includes a cam pivotally connected to the piercing part and rotatable between locked and unlocked positions. At the locked position, a protrusion formed on the cam abuts a lateral edge of the piercing part to prevent the operating member from spontaneously rotating back to the unlocked position. A bent flange is formed at a periphery of the cam and engages with the engaging part.

Heat sink fastener

A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires () therein. The heat dissipation device includes a heat sink assembly. A wire fixture () is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate () positioned on the heat sink assembly. A bridge () projects from the mounting plate to form a receiving room () below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.

Heat dissipation device having wire fixture

A fastener () for mounting a heat-radiator () to an electronic device () on a circuit board () is disclosed. The heat-radiator and the circuit board have aligned holes (). The fastener includes a head () having an upper portion () with a large diameter and a lower portion () with a smaller diameter, a cylindrical spring () captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire () having a first end portion fixed on said head and a second end portion bent to form an engaging portion (). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Fastener for mounting heat-radiator to electronic device

A heat dissipating device assembly for an electronic components (), includes a heat sink () for contacting the electronic component, and a locking device () and a back plate unit () for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module () located around the electronic component for supporting the heat sink thereon, and a clip () pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

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Shenzhen, China

Jin-Song Feng