Opto Tech Corporation

Oriental System Technology Inc.

Metrodyne Co., Ltd.

Other

Industrial Technology Research Institute

Godsmith Sensor Inc.

Jin-Shown Shie

San-Bao Lin

Simon Tsao

Ping-Kuo Weng

James Huang

Clark Liang

Jerry You

Mang Ou-Yang

Chen-Kuei Chung

Ming-Der Lin

Chen-Tang Huang

San Bao Lin

Chien-Chen Hung

Cheng-Wei Yang

Chung-Nan Chen

Yi-Chun Liao

Chi-Tseng Chang

Chih-yuan Yen

Yeh-Tseng Li

Chung-Cheng Lin

Chein-Hsun Wang

Gwo-Dawn Chang

Hsin-Fang Lei

Chieh-Yi Chen

Mei-hsueh Peng

An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.

Infrared thermal emitter

A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

Chip-scale infrared emitter package

A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position. Furthermore, the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating. The other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap. Hence if there is any air bubble existing inside the housing due to insufficient filling, it will not dwell in the field of line-of-sight due to buoyancy. The possibility of scattering the LED light due to existing of the bubbles therefore is avoided.

Heat dissipation structure for solid-state light emitting device package

Method for the preparation of diffractive lens with one single etching step and using one single etching mask. While the widths and intervals of the masked areas of the photo masks are decided under a geometric relation, an etching mask can be prepared on the substrate of the lens where the widths and the intervals of the masked areas can be determined. As the included angle between the etching mask and the plan of the material of the lens is in a certain ratio to the etching efficiency of the etchant to the substrate of the lens, a one step etching process can be developed whereby multilevel diffractive lens with required number, widths and heights of the levels can be obtained. This invention also provides an oxidation-isotropic etching process on the diffractive lens so prepared.

Diffractive lens and preparation method thereof

This invention relates to a high-transimpedance solid-state switch manufactured by micromachining technology. A thermopile is formed by a thin-film structure capable of producing sufficient thermoelectrical voltage to drive a MOS transistor on and off, functioning like a switch. The driving thermoelectric voltage is generated by Joule's heat released by a thin-film heater disposed nearby a thermopile hot junction to generate a substantial temperature difference related to its cold junction. These elements can be monolithically integrated, wherein the heater and hot junctions are disposed on a thermal pad formed by micromachining having high thermal isolation. This invention has the following advantages: 1) the input and output ends are thermally coupled, thus are electrically isolated (very high transimpedance), therefore a small input power is able to control the MOS device having high output voltage and power; 2) the solid-state switch is a micromachined monolithic structure which is batch-producible, rather than the single-unit production for traditional mechanical switch; 3) when the present switch is ON/OFF, it is unnecessary to employ the charge leakage circuit essential for the current 'photoelectric-coupling MOS solid state switch', therefore the chip area is reducible; 4) the input of the switch for driving the heater can be designed to be high or low, AC or DC voltage, according to the necessity; 5) package of this invention may utilize the standard 'dual-in-line' structure, which is simpler and less costly compared with the photo-coupled switch whose package is 3-dimensional.

Solid-state switch driven by thermovoltaic generator

An absolute radiation thermometer capable of evaluating the absolute value of infrared radiation power emitted from a target and received by a radiation sensor by means of electrical calibration, and calculating the temperature of the target basing on the responsive signal generated in the radiation sensor. To solve 'Microphonic' problem, two identical sensors connected in parallel with the polarized orientations of their pyroelectric layers being in opposite directions so as to cancel the piezoelectric signals generated in the two sensors are used. Further, by using a floating power supply, which is isolated from the system power supply of the thermometer, for performing electrical heating, power supply noise can be greatly reduced.

Absolute radiation thermometer

A waveguide for tympanic thermometer formed by an elongate hollow member having substantially ellipsoidal shape truncated at both ends along its major axis direction. The waveguide is interposed between a tympanic membrane of which the temperature is to be measured and an infrared radiation sensor so as to guide the infrared radiation from the tympanic membrane to the sensor. Alternatively, the waveguide may also be a hollow member including an end portion having a gradually reduced inner diameter toward the side of sensor. The gradually reduced end portion is preferably of a truncated half ellipsoidal shape having a length between about 1/10 to about 1/3 of the distance from the sensor to the distal end of the waveguide.

Tympanic thermometer arrangement

A substrate structure of a monolithic gas sensor is disclosed, wherein the substrate structure is formed as a thermal resistant and insulating suspended thin plate configuration on a single crystal silicon substrate. The thin plate has formed thereon a heating resistor and coated with tin-oxide-base reducing gas-sensitive material. The thermal resistant thin plate formed on the silicon substrate comprises a native silicon oxide layer, a silicon-rich silicon nitride layer deposited on the native silicon oxide layer, and a top silicon oxide layer formed by thermal oxidation of a surface layer of the deposited silicon-rich silicon nitride layer. An oxide-nitride-oxide sandwiched composited configuration is thus formed that can relieve mechanical stresses internal to the thin plate. The suspended thermal resistantthin plate has corrugation portions formed near the plate edges for relieving mechanical stresses arising from thermal expansion of the silicon substrate and the thin plate when heated to high temperature. The heating resistor formed on the thin plate comprises a polysilicon layer and is covered by a passivation and then by an aluminum oxide layer having a thickness of about several hundred angstroms. The coated tin-oxide-based material is formed by thick-film screen printing to form a sensor film for the single-chip sensing element. Improved thermal and mechanical stress characteristics are obtained while achieving lower electrical power consumption and also maintaining low cost of manufacturing when batched produced.

Substrate structure of monolithic gas sensor

A structure for pyroelectric IR heat-sensing elements having a wide angle field of view is made by forming the essential heat-sensing elements and the related electronic elements into a planarized-packing configuration suitable for surface bonding. The heat-sensing elements are caused to be inclined and facing each other in a suspended structure so as to increase the sensing viewing angle.

Wide-view-angle and planarized-packing structure for IR heat sensing

A new structure of a vacuum meter with good designs of temperature compensation and stabilization, The structure comprises a floating plate made by a micro-machining technique and a thermal sensitive element installed on the floating plate, The floating plate has a number of suspending arms extending outward to supporting the floating plate in a cavity of a semiconductor substrate for good heat isolation. The area of the floating plate and the length and width of the suspending arm has a specific ratio for an optimized sensitivity. A dummy resistor for temperature compensation is composed by a serial connection of a constant resistor with almost zero temperature coefficient and the thermal sensitive elements in a specific ratio. The vacuum meter further overlap on a temperature-controlled thermoelectric cooling device and is covered by a thermal shield so that the temperatures on and circumferential to the floating plate can be maintained stably.

Structure of micro-pirani sensor

Growing community of inventors

Hsinchu, Taiwan

Jin-Shown Shie