Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Lg Display Co., Ltd.

Lg Innotek Co., Ltd.

Hyundai Motor Company

Kia Corporation

Korea Advanced Institute of Science and Technology

Texas Instruments Corporation

Kia Motors Corporation

Korea University Research and Business Foundation

Health Insurance Review & Assessment Service

Jin Seong Kim

Dong Joo Park

Yong Chan Park

Seung Kyeom Kim

Ji Young Chung

Ju Han Kim

Byong Woo Cho

Roger D St Amand

Jae Sung Park

Woon Kab Jung

Kwang Ho Kim

Jae Ung Lee

Se Hwan Hong

Ludovico Estrada Bancod

Yung Woo Lee

Yeo Chan Yoon

Gyu Wan Han

Mi Kyeong Choi

Jae Hwan Jung

Gi Jung Kim

Cha Gyu Song

Robert Francis Darveaux

Sung Jin Yang

Christopher J Berry

Ju Hoon Yoon

Louis W Nicholls

Dae Byoung Kang

Robert Lanzone

Edwin Joseph Adlam

Ho Sam Choi

Ki Wook Lee

Jae Yun Kim

Jae Dong Kim

Do Hyun Na

Gi Tae Lim

Hee Yeoul Yoo

Ki Rok Hur

Sung Hwan Cho

Yun Shick Eom

Yeon Soo Jung

Ye Sul Ahn

Jeong Wung Jeong

Bum Joon Kim

Sung Joo Oh

Kwang Seok Oh

You Jung Song

Young Kwon Kim

Hong Seok Yun

Young Ho Kim

Byong Jin Kim

Young Seok Kim

Chang Hwan Kim

Young Woo Lee

Bong Kul Min

Kurt Peter Wachtler

Jungkyu Choi

Jin Young Khim

Yeong Beom Ko

In Bae Park

EunNaRa Cho

Yong Jae Ko

Tae Kyeong Hwang

Ji Hoon Oh

Sung Woo Lim

Chun Yong Kang

Jo Hyun Bae

Yun Ah Kim

Sung Soon Park

Shunichi Kubota

Ji Chang Lee

Eun-Hee Jang

Hwiyoon Noh

Young Kwon Yang

La Young Choi

Roger D StAmand

Keun Ho Bang

Gwang Ho Kim

Ji Seung Lee

Byoung Min Lee

A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

Semiconductor device with through-mold via

Disclosed is a touch sensitive display apparatus which decreases a load of each of a plurality of touch electrodes and reduces a load deviation between the plurality of touch electrodes, thereby enhancing image quality. The touch sensitive display apparatus comprises a touch sensitive panel. The touch panel comprises a plurality of touch electrodes comprising at least a first touch electrode. The first touch electrode comprises a plurality of first touch electrode lines that are parallel to each other. A first touch signal line is connected to the plurality of first touch electrode lines of the first touch electrode, and the first touch electrode is driven for image display and touch sensing via the first touch signal line. A first connecting line is in a different layer than the first touch electrode lines, and the first connecting line is connected to the plurality of first touch electrode lines.

Touch display apparatus

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.

Semiconductor device and manufacturing method thereof

A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Semiconductor package and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Sensor package and manufacturing method thereof

In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. Other embodiments of the semiconductor device comprise one or more interposers which are electrically connected to the through-mold vias, and may be covered by the package body and/or disposed in spaced relation thereto. In yet other embodiments of the semiconductor device, the interposer may not be electrically connected to the through mold vias, but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

A hydrocarbon adsorbent includes a core-shell particle including a core and a shell surrounding the core, wherein the core includes ion-exchanged zeolite that is ion-exchanged with a metal other than silicon (Si) and aluminum (Al) and the shell includes a mesoporous metal oxide.

Hydrocarbon adsorbent

Disclosed are an electrode including a polymer matrix and a catalyst including metal nanoparticles and a conductive polymer shell and, a method of preparing the same. According to various exemplary embodiments of the present invention, various hybrid nano-composites may be formed by a combination of other conductive polymers than P3HT with metal nanoparticles. For example, the method may include selectively disposing metal nanoparticles to a surface modified conductive polymer including a block copolymer of two or more types of conductive polymers.

Electrode including metal nanoparticles having conductive polymer shell and conductive film and method for manufacturing the same

Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Thin bonded interposer package

A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

Methods and structures for increasing the allowable die size in TMV packages

Growing community of inventors

Goyang-si, South Korea

Jin Seong Kim