Samsung Electro-mechanics Co., Ltd.

Jin Seok Moon

Yul Kyo Chung

Seung Hyun Sohn

Soo Hyun Lyoo

Keun Yong Lee

Hyung Mi Jung

Seong Hyun Yoo

Hyun Jun Lee

Seung Eun Lee

Seok Bae

Mano Yasuhiko

Hyuk-Sang Kwon

Tae-Yoon Kim

Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board

Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board

Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and

Thin film capacitor-embedded printed circuit board and method of manufacturing the same

The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

Thin film-capacitor-embedded printed circuit board and method of manufacturing the same

A planar magnetic inductor and a method for manufacturing the same are provided. The planar magnetic inductor comprises an insulating oxide magnetic layer formed on a substrate, a conductive coil separated from a lower surface of the insulating oxide magnetic layer while being completely embedded in the insulating oxide magnetic layer, and a cover layer formed on the insulating oxide magnetic layer for protecting the insulating oxide magnetic layer. The insulating oxide magnetic layer comprises a lower insulating oxide magnetic layer, and an upper insulating oxide magnetic layer formed on the lower insulating oxide magnetic layer, such that the conductive coil is completely embedded in the upper insulating oxide magnetic layer. The planar magnetic inductor can realize excellent high frequency characteristics and high inductance with a reduced scale.

Growing community of inventors

Kyungki-do, South Korea

Jin Seok Moon