Kingston Technology Corporation

Jmr Research Inc.

Jin S Wang

Ben Wei Chen

David Hong-Dien Chen

A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.

Small form factor molded memory card and a method thereof

A package for the storage and display of products such as video game cartridges and compact disks. The package consists of an elongated strip of transparent flexible plastic or similar material having a series of pockets or pouches attached to the the strip. The package may be hung from a hole at one end of the strip to display the contents of each of the pockets, the pockets all opening upwards towards the end of the strip from which the package is hung. The strip includes hinging portions between the pockets so that the cartridges or disks in the pockets can be folded together, in a zig-zag or accordion fashion to form a compact stack. When folded into a stack, a flap at one end of the strip may be folded over one side of the stack and fastened to the other end of the strip so as to hold the cartridges or disks in place in the stack, but at the same time allowing the side of the stack opposite to the flap to be opened so that the cartridges or disks can be examined one at a time, in a manner similar to opening a book, one page at a time.

Growing community of inventors

Torrance, CA, United States of America

Jin S Wang