Amkor Technology, Inc.

Jin Ryang Hwang

Won Chul Do

Ji Hun Lee

Young Rae Kim

Min Hwa Chang

Wang Gu Lee

Mi Kyeong Choi

Dong Hyun Kim

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Semiconductor device and manufacturing method thereof

Growing community of inventors

Gwangju-si, South Korea

Jin Ryang Hwang