Tpk Glass Solutions (Xiamen) Inc.

Jin Run Lin

Zhi Min Shao

Feng Ming Chen

The present disclosure is related to a processing carrier module comprising a carrier layer and a container. The carrier layer comprises a carrier surface, a first lateral surface, and a second lateral surface. The first lateral surface is connected to carrier surface and has at least one first protruding structure. The second lateral surface is connected to carrier surface and has at least one second protruding structure. The first lateral surface is opposite to the second lateral surface. The container comprises at least one first fastening structure and at least one second fastening structure. The first fastening structure and the second fastening structure are respectively disposed on opposite sides of the container. The first fastening structure engages with the first protruding structure, and the second fastening structure engages with the second protruding structure.

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Xiamen, China

Jin Run Lin