Samsung Electro-mechanics Co., Ltd.

Jin Ok Han

Tae Young Kim

Moon Soo Park

Jin Su Park

Jong Ho Lee

Dong Hwan Lee

Jae Yeol Choi

Jin Kyung Joo

Hong Seok Kim

A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.

Multilayer capacitor including via electrodes and board having the same

There is provided a chip electronic component including: a magnetic body having an internal coil part embedded therein, wherein the magnetic body includes: a central portion provided inside of the internal coil part and including a core; and an outer peripheral portion provided outside of the central portion, the central portion and the outer peripheral portion having different magnetic permeabilities.

Chip electronic component

The manufacturing method of a chip electronic component may include: forming a coil pattern part on at least one surface of an insulating substrate; forming a thin polymer insulating film to follow a surface shape of the coil pattern part; forming a primer insulating layer on one surface of a magnetic sheet; disposing the magnetic sheet on which the primer insulating layer is formed on an upper portion and a lower portion of the insulating substrate on which the coil pattern part is formed and pressing the magnetic sheet to form a magnetic body in which an additional insulating film is formed on the coil pattern part; and forming an external electrode on at least one end surface of the magnetic body so as to be connected to the coil pattern part.

Method of manufacturing chip electronic component

Growing community of inventors

Suwon-si, South Korea

Jin Ok Han