Samsung Electro-mechanics Co., Ltd.

Jin Oh Park

Won Seok Lee

Chi Seong Kim

Guh Hwan Lim

Eun Sun Kim

Jin Uk Lee

Sang Yun Lee

Yu Mi Kim

A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

Printed circuit board and method for manufacturing the same

A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.

Printed circuit board

Growing community of inventors

Suwon-si, South Korea

Jin Oh Park