Occidental Chemical Corporation

Sumitomo Bakelite Company Limited

Other

Jin-O Choi

John A Tyrell

Michael C Hausladen

David Y Tang

Jerold C Rosenfeld

John Tyrell

Paul D Dubell

A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80&deg; C. and about 160&deg; C. is prepared. The solution or slurry is heated to a temperature between about 80&deg; C. and about 160&deg; C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Method of making a polyimide in a low-boiling solvent

Disclosed is a method of immobilizing the fingers of circuitry. A coating is formed of a liquid adhesive on the surface of a release film in a pattern of strips in positions perpendicular to and across the positions the fingers of the circuitry will have when the pattern of adhesive is bonded to it. The coating is rendered non-tacky and is bonded across and between the fingers and the release film is removed from the coating.

Method of immobilizing circuitry fingers

Disclosed is a solution of a hot melt adhesive which comprises an organic solvent and a fully imidized polyamideimidesiloxane. The polyamideimidesiloxane is the reaction product of dianhydride monomer with diamine monomer. About 0.5 to about 30 mole % of the monomers are siloxane-containing diamine or dianhydride monomers. Up to about 50 mole % of the diamine monomer is aliphatic diamine that contains neither siloxane groups nor amide linkages, and about 40 to about 99 mole % of the diamine monomer is aromatic diamine that does not contain siloxane groups. The aromatic diamine is (1) about 50 to about 100 mole % unsymmetrical aromatic diamine that has at least two aromatic rings, two amine groups on different aromatic rings, and contains an amide linkage in the chain and (2) up to about 50 mole % of aromatic diamine that contains neither siloxane groups nor amide linkages. A tape is made by forming a coating of the solution on a film. An article can be attached to a substrate by applying the tape to the substrate or the article, heating the tape above its softening point, and pressing the article or substrate, respectively, into the tape.

Polyamideimidesiloxane hot melt adhesive

Disclosed is a method of forming a pattern on a substrate. A first solution is formed of an organic solvent and monomers of diamine and dianhydride. The monomers are polymerized to form a polyamic acid soluble in the organic solvent. About 20 to about 95% of the amic acid groups in the polyamic acid are imidized to form a partially imidized polyamic acid. A more concentrated solution of the partially imidized polyamic acid is formed. This can be accomplished by precipitating the partially imidized polyamic acid from the first solution and dissolving it in a second organic solvent to form a second solution. The second solution is applied to the substrate and the solvent is evaporated to form a coating of the partially imidized polyamic acid on the substrate. A portion of the coating is removed to form a pattern on the substrate and the remaining partially imidized polyamic acid is fully imidized on the substrate.

Method of forming polyimide patterns on substrates

Disclosed is a tape which comprises a non-tacky, free-standing, 90 to 100% imidized polyimide film containing 0.1 to 30 wt % of a solvent having a releasable film adhering to at least one side. The film is used to form coatings on substrate or as an adhesive to bond substrates together.

Tape comprising solvent-containing non-tacky, free-standing, fully

Disclosed is a method of making a polyimide pattern on a substrate. A solution is prepared in an organic solvent of a polyamic acid and about 1 to about 10 wt. % of a photosensitizer that becomes more water soluble when exposed to actinic light. A coating is formed of the solution on a substrate and solvent is evaporated from the coating. A positive photoresist is applied over the coating and is exposed to a pattern of actinic light. The exposed portions of the photoresist are removed as well as the exposed portions of the polyamic acid coating thereunder. The remaining photoresist is removed and the polyamic acid coating is imidized.

Polyimide patterning

Disclosed is a method of making a free-standing polyimide film. A solution is prepared of a polyamic acid 20 to 98% imidized in an organic solvent and a coating of the solution is applied to a non-stick substrate. The coating is heated to a temperature high enough to evaporate all but 1 to 20 wt % of the solvent and form a film. The film is removed from the substrate and is heated to evaporate the solvent to less than 1000 ppm.

Method of making free-standing polyimide film

Disclosed is a method of forming a polyimide coating in a pattern on a surface. A first solution is prepared of an organic solvent, and diamine and dianhydride monomers. The monomers are polymerized to form a polyamic acid that is soluble in the organic solvent. About 10 to about 95% of the amic acid groups in the polyamic acid are imidized, forming a partially imidized polyamic acid. A more concentrated solution of the partially imidized polyamic acid is prepared and about 0.1 to about 10 wt % of a thixotrope is mixed with the more concentrated solution to form a paste. A template is placed over the surface and the paste is forced through the template onto the surface. The solvent is evaporated and the partially imidized polyamic acid on the surface is fully imidized.

Forming polyimide coating by screen printing

Disclosed is a polyimide ammonium salt comprising the reaction product of an ethylenically unsaturated amine with an aromatic polyimide having pendant carboxylic acid groups, said polyimide comprising the reaction product of diamine and aromatic dianhydride, where the diamine comprises an aromatic carboxylic acid diamine having at least one carboxylic acid. A substrate can be coated with the polyimide ammonium salt by forming a composition of a crosslinking agent and a solution of the polyimide salt in an organic solvent, spreading the composition on the substrate, evaporating the solvent to form a coating, exposing at least some of the coating to actinic radiation to crosslink and insolubilize the exposed portions of the coating, and washing the unexposed portions away by dissolving them in an organic solvent.

Photocrosslinkable polyimide ammonium salts

Disclosed is an aromatic diamine having the general formula ##STR1## where A is a group containing at least one aromatic ring, each Y is independently selected from ##STR2## R is a group containing at least one olefinically unsaturated group, R' is hydrogen, alkyl to C.sub.25, aryl, or R, n is 1 to 4, and the number of olefinic groups in Y is at least 3 when each Y is ##STR3## and otherwise is at least 2. Photosensitive polyamic acids and polyimides can be prepared from the aromatic diamines which can be crosslinked with light to a mask to form patterns on a substrate.

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Getzville, NY, United States of America

Jin-O Choi