Winbond Electronics Corporation

Industrial Technology Research Institute

Jin-Neng Wu

Yen-Jui Chu

Kuen-Min Lee

Yu-Chang Chao

Ping-Yu Chen

Kuo-Ming Huang

Che-Wei Chang

Chun-Hung Lin

Hsin-Hung Chou

Mu-Kai Huang

Yao-Hsing Ko

A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.

Method for manufacturing package structure

A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.

Package structure and method for manufacturing the same

Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.

Semiconductor device including uneven contact in passivation layer

Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.

Method of manufacturing circuit structure

Semiconductor device including uneven contact in passivation layer and method of manufacturing the same

Provided is a semiconductor package including first to third semiconductor dies, first to third RDL layers, conductive vias and an encapsulant, and a manufacturing method thereof. The first RDL layer is on an active surface of the first semiconductor die. The second semiconductor die is on the first RDL layer and electrically connected thereto through first TSVs. The conductive vias are on the first RDL layer and around the second semiconductor die. The encapsulant encapsulates the second semiconductor die and the conductive vias. The second RDL layer is on the encapsulant. The third semiconductor die is on the second RDL layer and electrically connected thereto through second TSVs. The third RDL layer is on the third semiconductor die. The area of the second semiconductor die is smaller than that of the first semiconductor die. The area of the third semiconductor die is larger than that of the second semiconductor die.

Semiconductor package and manufacturing method thereof

Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.

Redistribution layer (RDL) structure and method of manufacturing the same

A session-based remote management system and a load balance controlling method are provided. The session-based remote management system includes a plurality of client servers, a load balancing server, a plurality of local databases, a shared database and a monitor server. The session-based remote management system is adapted for a plurality of clients coupling to a plurality of local databases and a shared database through a plurality of client servers. The load balance controlling method includes following steps. A computing performance of the clients and the client servers are analyzed. The clients are dispatched to the client servers based on the computing performance of the clients and the client servers. A crash probability of the client servers are dynamically predicted to obtain a health value.

Session-based remote management system and load balance controlling method

A remote management system with adaptive management mechanism is disclosed, by using an adaptive feedback session management decision (AFSMD) server to connect a plurality of clients and a plurality of cluster nodes respectively. AFSMD server includes a session ID map manager for recording mapping between session and cluster node forwarded to; a decision grade producer, for producing a decision grade to determine the session management manner required for the current session; a session connection number query (SCNQ) for communicating with a storage to obtain a total connection number of a client; a cluster node communication interface, for communicating with cluster nodes and for information cluster nodes if session needs duplication; and a session management decision controller for overseeing the entire session management decision flow to achieve higher efficiency.

Remote management system with adaptive session management mechanism

Distributed resource management systems and methods thereof are provided. Distributed resource management system at least includes resource managers (RMs) and resource consumers (RCs). RMs obtain current usage information of the resources of the distributed resource management system and generate first distributed resource graphs according to the current usage information of the resources. RMs obtain identification information of the RMs and generate second distributed resource graphs according to the identification information. RCs obtain a resource expense information regarding resource expense required by a plurality of jobs and generates third distributed resource graphs according to the resource expense information. A compound distributed resource graph (CDRG) is obtained by combining the first, second, and third distributed resource graphs and then the jobs to be performed by a corresponding amount of the resources within the distributed resource management system are determined according to the CDRG.

Growing community of inventors

Taichung, Taiwan

Jin-Neng Wu