Samsung Electro-Mechanics Co., Ltd.

Jin Mun Ryu

Jung Jin Kim

Hyung Kyu Park

Tae Young Kim

Jung Seok Lee

Dong Hwan Kim

Jung Hwi Kim

In Taek Song

Bo Bin Kim

Yun Seok Woo

Jae Sub Cho

Seung Yun Oh

Bo Kyoung Kim

Moon Koog Song

The present invention provides a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.

Solar cell module and method of manufacturing the same, and mobile apparatus with the solar cell module

Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

Camera module and method of manufacturing the same

Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expansion pads formed on the inclined surfaces of the wafer, including the pad, such that the expansion pads are electrically connected to the pad, a bottom surface of the expansion pads being on a straight line with respect to that of the wafer; a support formed on the expansion pads to support both bottom surfaces of a glass, the support having a height to provide a space where an air cavity is formed; and a glass disposed on the support to provide the air cavity over the wafer.

Wafer level chip scale package of image sensor and manufacturing method thereof

A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member. The mold unit exposes the external connection terminal of the substrate to a lateral surface of the substrate. The glass cap molding package and a manufacturing method thereof and a camera module including the same reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process.

Glass cap molding package, manufacturing method thereof and camera module

Provided is a camera module including an image sensor module including a substrate; an image sensor that is mounted on a top surface of the substrate; a ground pad that is disposed on a bottom surface of the substrate; and a sealing member that seals the image sensor mounted on the substrate; a lens member that is stacked on the image sensor module; and a conductive member that is formed on side surfaces of the image sensor module and the lens member so as to be electrically connected to the ground pad.

Provided are a WLCSP of an image sensor and a method of manufacturing the same. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer has an image sensor and a pair of pads disposed thereon, a portion of the bottom surface of the image sensor being exposed outward from the both ends of the wafer. The support members are disposed on the pads to support the both bottom sides of the glass, the support members being formed to a predetermined thickness to provide a space for forming an air cavity. The glass is safely seated on the support members such that the air cavity is formed on the wafer. The metal bumps are disposed on the both sides of the wafer corresponding to the pads such that the bottom surfaces of the metal bumps protrude beyond the bottom surface of the wafer and form conductive lines electrically connected to the pads. Therefore, the package can be directly attached to a camera module even without using a separate PCB or ceramic substrate. Accordingly, the module assembly space can be reduced to miniaturize the product. Also, the substrate manufacturing costs can be reduced to lower the unit price of the product.

Wafer-level chip-scale package of image sensor and method of manufacturing the same

Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.

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Yongin, South Korea

Jin Mun Ryu