Samsung Electro-mechanics Co., Ltd.

Jin Mo Ahn

Jae Yeol Choi

Ji Hong Jo

Yun Suk Oh

Ga Young An

Do Young Jeong

Jong Ik Park

Jeong Mo Kang

Ki Jun Kim

Beom Joon Cho

Dong Hwi Shin

Jae Young Na

Sun Cheol Lee

Min Young Kim

Eun Hee Jeong

Min Sung Choi

Sang Roc Lee

Seung Hyun Park

A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface of the body, and extending onto a portion of each of the third to sixth surfaces of the body; a second external electrode disposed on the second surface of the body and extending onto a portion of each of the third to sixth surfaces of the body; and an insulating layer disposed on the third to sixth surfaces of the body, and extending onto the first and second external electrodes, wherein in at least one of cross-sections in first and second directions and cross-sections in first and third directions, the insulating layer extends outwardly beyond the first and second surfaces of the body.

Ceramic electronic component including insulating layer

A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.

Ceramic electronic component with openings in electrode

A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.

Multilayer electronic component including cover layer having insulating and conductive portions

A multilayer electronic component includes: a body including a dielectric layer and internal electrodes and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode including a connection portion disposed on one of the third and fourth surfaces, an upper band portion extending from the connection portion onto a portion of the second surface, and a lower band portion extending onto a portion of the first surface. The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion, and the Pd plating layer is disposed to extend onto a portion of the connection portion.

Multilayer electronic component and board for mounting the same

A multilayer electronic component includes an external electrode having a connection portion and a band portion. An organic layer is disposed between an electrode layer and a plating layer of the band portion of the external electrode, and a conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the external electrode.

Multilayer electronic component

A multilayer capacitor includes a body including a stack structure of a plurality of dielectric layers, and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween. A stress alleviation portion is disposed on at least one surface among surfaces of the body, and an external electrode is disposed on an external portion of the body and connected to the internal electrodes. The stress alleviation portion includes a first resin layer adjacent to the body, and a second resin layer covering the first resin layer and including a filler dispersed in a resin of the second resin layer.

Multilayer capacitor

A coil component includes a body having a winding coil and a plurality of guide members therein. The guide members are spaced apart from each other along an outer periphery of the winding coil, and each of the guide members has an exposed surface exposed externally of the body. A method for manufacturing a coil component includes seating opposing ends of a winding coil on a support member of a frame having guide members restricting movement of the winding coil relative to the frame. A body is formed that embeds the winding coil and at least a portion of each of the guide members therein, and the guide members restrict movement of the winding coil during the forming of the body.

Coil component and method for manufacturing same

A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Multilayer electronic component and board having the same

A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.

Coil component assembly for mass production of coil components and coil components made from coil component assembly

A capacitor component includes a body including a plurality of dielectric layers having a stacked structure, and first and second internal electrodes which are alternately disposed while having the dielectric layer interposed therebetween; and first and second external electrodes formed on an outer surface of the body, and connected to the first and second internal electrodes, respectively, wherein the body includes an active region having capacity by the first and second internal electrodes and a cover region located above and below the active region, the cover region includes a protection pattern of a metal material connected to the first external electrode or the second external electrode, and the protection pattern does not overlap with the internal electrode having a different polarity among the first and second internal electrodes in a thickness direction of the body.

Capacitor component with metallic protection pattern for improved mechanical strength and moisture proof reliability

A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.

Coil component

A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate.

Coil-embedded integrated circuit substrate and method of manufacturing the same

A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.

Multilayer ceramic capacitor and board having the same

A power inductor includes: a substrate on which an internal electrode coil pattern is formed; and composite layers formed by alternately stacking first sheets formed of a mixture of coarse metal powder and fine metal powder and second sheets formed of fine metal powder on the internal electrode coil pattern of the substrate, thereby obtaining high inductance.

Growing community of inventors

Suwon-si, South Korea

Jin Mo Ahn