Samsung Sdi Co., Inc.

Samsung Electronics Co., Ltd.

Cheil Industries Inc.

Jin Min Cheon

Min Gyum Kim

Dong Hwan Lee

Jin Woo Choi

Ki Hyeok Kwon

Joo Young Chung

Seung Ryong Han

Seung Ho Han

Hwan Sung Cheon

Jung Seob Kim

Dong Hun Lee

Sung Young Yun

Yeong Suk Choi

Jin Ho Seo

Eun Jung Lee

Seog Heon Ham

Shuichi Shimokawa

Dal-Ho Huh

Hyung Rang Moon

Young Kyun Jeong

Jong Hwan Park

In Sun Park

Yun Jung Kim

Yoon Man Lee

So Yoon Kim

Woo Chul Na

KyoungChul Bae

Ji Yoon Cho

The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.

Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same

The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.

Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same

The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.

Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same

A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1: 

Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same

The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.

Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same

A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1: 

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same

An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7: 

Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same

A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1: 

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: 

Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same

A composition for an organic thin film may include a first compound having a linear alkylene oxide moiety and a haloalkyl moiety, and a second compound having conductivity and being capable of controlling a work function.

Composition for organic thin film, organic thin film, and electronic device including the organic thin film

A data sampler and a photo detecting apparatus compensate a reference signal with offset information measured from a unit pixel, and compare an offset-compensated reference signal with a data signal, thereby minimizing the impact of an offset occurring with an increase of gain in the data sampler.

Growing community of inventors

Uiwang-si, South Korea

Jin Min Cheon