Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Jin Mikata

Taiji Ito

Masaya Shimamura

Takehiko Kai

Mikio Aoki

Kenzo Kitazaki

Masashi Hattori

Yosuke Onda

Kenichi Shimomai

Ryuichi Sunagawa

Yutaka Aoki

Ryuji Murata

An odor is detected with high accuracy. A sensing system includes: a sensor apparatus including a filter to remove an odor-causing substance contained in air and a sensor unit including one or more detection elements to detect an amount of the odor-causing substance contained in air; and an information processing apparatus including a difference calculation unit to calculate a difference between a detection value of each of the one or more detection elements, the detection value indicating an amount of the odor-causing substance contained in air that has passed through the filter and a detection value of each of the one or more detection elements, the detection value indicating an amount of the odor-causing substance contained in air that has not passed through the filter, and a determination unit to determine an odor of air based on the calculated difference.

Sensing system, information processing apparatus, and sensor apparatus

An air conditioning system includes: an air conditioner to regulate a state of air in a room; a sensor device including at least one detector to detect an amount of an odor-causing substance included in the air in the room; and a control device to control operation of the air conditioner. The control device includes: a first acquisition unit to acquire a detected value of each of the at least one detector at a first timing when a person is present in the room; a second acquisition unit to acquire a detected value of each of the at least one detector at a second timing later than the first timing; a difference calculator to calculate a difference between the detected value at the first timing and the detected value at the second timing; and an instruction unit to control operation of the air conditioner based on the difference.

Air conditioning system, vehicle, control device, and control method

Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.

Wireless module and method for manufacturing the same

An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

Electronic component module and method of manufacturing the same

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.

Wireless module and method for manufacturing wireless module

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.

A wireless module includes: a rectangular shaped substrate; an antenna element provided in a first region of the substrate; a rectangular shaped integrated circuit element provided in a second region of the substrate, the integrated circuit element including, in a single package, an RF unit to process an RF signal, a baseband unit to process a baseband signal, and a power supply unit; and discrete components provided in a third region of the substrate, the integrated circuit element provided such that two parallel sides of the integrated circuit element are along long sides of the substrate, neither the first region nor the third region being provided between each long side of the substrate and each side of the integrated circuit element along the long side, the first region and the third region being provided to be aligned in a longitudinal direction of the substrate with respect to the second region.

Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

Method of manufacturing electronic component module

A snow quality measuring apparatus according to one aspect of the present invention includes a plurality of reflectors, at least one transmitter, at least one receiver, and a measuring device. The plurality of reflectors are respectively arranged at a plurality of prescribed heights above the ground. The transmitter emits radio waves towards the plurality of reflectors, and the receiver receives the reflected waves of the radio waves from the plurality of reflectors. The measuring device measures snow quality of snow on the ground at the prescribed plurality of heights based on the respective reflected waves to from the plurality of reflectors as received by the receiver.

Snow quality measuring apparatus and snow quality measuring method

A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.

Method of making plural electronic component modules

A first radiating electrode of a split ring resonator type is formed on a side face of a substrate of a rectangular cuboid antenna device so as to be at a right angle to a ground electrode surface, a second radiating electrode is provided on a top surface of the substrate, the first radiating electrode and the second radiating electrode are capacitively coupled, and the resonance frequency of the first radiating electrode and second radiating electrode are configured to be approximately in symmetry with the central frequency of the used frequency.

Chip antenna and communication circuit substrate for transmission and reception

A passive element has an electrical length such that a resonance mode thereof is in a target frequency band, and first and second feed elements, each of which has an electrical length such that a resonance mode thereof is not in the target frequency band. The first feed element has a first coupling conductive part, and a first connecting conductive part, which has a continuous shape with the first coupling conductive part. The second feed element has a second coupling conductive part, and a second connecting conductive part, which has a continuous shape with the second coupling conductive part. The first coupling conductive part is disposed parallel and adjacent to the passive element. The second coupling conductive part is disposed parallel and adjacent to the passive element. The first connecting conductive part and the second connecting conductive part are disposed adjacent and parallel to each other.

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Tokyo, Japan

Jin Mikata