Samsung Electro-mechanics Co., Ltd.

Jin Man Han

Jang Seok Yun

Young Key Kim

Hyung Min Kim

Yong Sung Kim

Jang Ho Park

Sang Yeob Cha

Ki Won Suh

Sung Jun Kim

A piezoelectric device package includes a board having a lower surface and an upper surface, a plurality of terminals disposed on the lower surface, a piezoelectric device disposed on the upper surface, a thermistor layer and a resistance layer disposed on the lower surface, and a cap lead covering an upper portion of the board.

Piezoelectric device package

A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.

Chip resistor element

A chip resistor includes a substrate having first and second electrodes disposed on one surface thereof to be separated from each other. A first resistor electrically connects the first electrode to the second electrode, and a second resistor electrically connects the first electrode to the second electrode. When temperatures of the first electrode and the second electrode are different from each other, thermo electromotive force generated from the first resistor is less than thermo electromotive force generated from the second resistor, and a temperature coefficient of resistivity (TCR) of the second resistor is lower than the TCR of the first resistor.

Chip resistor

There is provided a chip resistor including a ceramic substrate; a first resistance layer formed on the ceramic substrate and including a first conductive metal and a first glass; and a second resistance layer formed on the first resistance layer, including a second conductive metal and a second glass, and having a smaller content of glass than the first resistance layer, thereby obtaining relatively low resistance and a relatively small temperature coefficient of resistance (TCR).

Growing community of inventors

Suwon-si, South Korea

Jin Man Han