Samsung Electronics Co., Ltd.

Jin-Kyu Kang

Mun-Pyo Hong

Sang-Il Kim

Soo-Guy Rho

Wan-Shick Hong

Snag-Gab Kim

Kihyun Hwang

Jung-Hwan Lee

Sunggil Kim

Woonkyung Lee

Bonyoung Koo

Jae Duk Lee

Jeeyong Kim

Jintae Noh

Se Jun Park

Byoungsun Ju

Rae Young Lee

Gu Yeon Han

Jaeduk Lee

Sejun Park

Hye Ji Lee

Jung Hoon Lee

Sunil Shim

Joon-Sung Lim

Jaehoon Jang

Jang-Gn Yun

Woojae Jang

Okcheon Hong

Changsub Lee

Seungwan Hong

Euido Kim

A semiconductor memory device includes a source layer, a channel structure, gate electrodes on the source layer and spaced apart on a sidewall of the channel structure, and a common source line. The gate electrodes include a first word line group including first and second gate electrodes and a second word line group including third and fourth gate electrodes. The semiconductor memory device, in response to a voltage of the common source line reaching a target voltage, causes an inhibition voltage to be applied to the second word line group and an erase voltage to be applied to the first word line group in a first erase operation interval, and causes the inhibition voltage to be applied to the first word line group and the erase voltage to be applied to the second word line group in a second erase operation interval.

Semiconductor memory device and storage system including semiconductor memory device

A non-volatile memory device including: a memory cell array including non-volatile memory blocks connected to a plurality of word lines, a plurality of bit lines and a common source line; a common source line driver configured to supply a common source line voltage to the common source line; a page buffer unit configured to supply a bit line voltage to at least one of the plurality of bit lines; a control logic circuit configured to adjust the common source line voltage and the bit line voltage; and a channel initialization circuit, wherein the channel initialization circuit sets the common source line voltage and the bit line voltage to an initialization pulse, and the channel initialization circuit applies the initialization pulse between a plurality of read sections in which a read voltage is applied to at least two of the plurality of word lines.

Non-volatile memory device which utilizes a pulse applied to a bit line and/or a common source line between read operations to reduce noise

A semiconductor memory device includes a stack structure including electrodes and insulating layers alternately stacked on a substrate, and a vertical channel structure penetrating the stack structure. The vertical channel structure includes a semiconductor pattern and a vertical insulating layer between the semiconductor pattern and the electrodes. The vertical insulating layer includes a charge storage layer, a filling insulating layer, and a tunnel insulating layer. The vertical insulating layer has a cell region between the semiconductor pattern and each electrode and a cell separation region between the semiconductor pattern and each insulating layer. A portion of the charge storage layer of the cell region is in physical contact with the tunnel insulating layer. The filling insulating layer is between the semiconductor pattern and a remaining portion of the charge storage layer of the cell region.

Three-dimensional semiconductor memory device

A three-dimensional semiconductor memory device including a stack structure including gate structures and first dielectric patterns alternately stacked, a vertical channel penetrating the stack structure, and a charge storage layer extending from between the vertical channel and the first gate structures to between the vertical channel and the first dielectric patterns. The gate structures include first gate structures having a top surface and a bottom surface facing each other and having different width. The charge storage layer includes first segments between the vertical channel and the first gate structures, and second segments between the vertical channel and the first dielectric patterns. A thickness of the first segments is greater than a thickness of the second segments. One of the width of the top surface and the width of bottom surface of each first gate structure is the same as that of a first dielectric pattern on the first gate structure.

An operating method of a nonvolatile memory device is provided which sequentially performs a plurality of erase loops to erase at least one of a plurality of memory blocks. The operating method comprises performing at least one of the plurality of erase loops; performing a post-program operation on the at least one memory block after the at least one erase loop is executed; and performing remaining erase loops of the plurality of erase loops. The post-program operation is not performed when each of the remaining erase loops is executed.

Methods of operating a nonvolatile memory device

Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a charge storage pattern formed on a substrate; a dielectric pattern formed on the charge storage pattern; a first conductive pattern including silicon doped with a first impurity of a first concentration, the first conductive pattern being disposed on the dielectric pattern; and a second conductive pattern including metal silicide doped with a second impurity of a second concentration, the second conductive pattern being disposed on the first conductive pattern. The first concentration may be higher than the second concentration.

Semiconductor devices

Semiconductor devices and methods of manufacturing the same

A black matrix having an opening at pixels of a matrix array in a display area, a common wire including common pads and common signal lines, and gate pads in a peripheral area, and an alignment key in outer area to align interlayer thin films are formed on an insulating substrate. Red, blue and green color filters the edge of which overlap the black matrix are formed at the pixels on the insulating substrate, and an organic insulating layer covering the black matrix and the color filters and having a contact hole exposing the gate pad is formed thereon. A gate wire including a gate line connected to the gate pad through the contact hole and a gate electrode connected to the gate line is formed on the organic insulating layer, and a gate insulating layer covering the gate wire is formed on the organic insulating layer. A semiconductor pattern and ohmic contact layers are sequentially formed on the gate insulating layer of the gate electrode. A data wire including a source electrode and a drain electrode that are made of a same layer on the ohmic contact layers and separated from each other, and a data line connected to the source electrode and defining the pixels of a matrix array by crossing the gate line is formed on the gate insulating layer. A passivation layer covering the data wire and having contact holes exposing the gate pad and the data pad is formed, and a pixel wire including a pixel electrode, a redundant gate pad, a redundant data pad that are respectively connected to the drain electrode, the gate pad and the data pad through the contact holes.

Thin film transistor array panel for liquid crystal display

Thin film transistor array panel for a liquid crystal display and methods for manufacturing the same

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Seoul, South Korea

Jin-Kyu Kang