Okins Electronics Co., Ltd.

Other

Sensorview Co., Ltd.

Okins Electronics., Ltd

Jin Kook Jun

Sung Gye Park

Byoung Nam Kim

Kyoung Il Kang

Sang Woo Han

Sung Gyu Park

Jong Wook Ham

Hyun Duk Kim

Chan Ho Lee

Soung Hun Choi

Hyung Il Jeon

Young Hoon Kim

Jae Hyun Seo

Seung Hyun Noh

Young Shik Park

Young Ryong Yoon

Jae Weon Shim

Dae Joong Yoon

Myung Gi Seo

Sang Hoon Cha

A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.

Test socket

A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.

Contact pins for test sockets and test sockets comprising the same

Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Magnetic collet

Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.

Cable adaptor coaxially connected to an outer conductor and signal line of a cable

Disclosed is a cable adaptor which is connected to a cable including an outer conductor. The adaptor includes a contact pin which comes into contact with a signal pin of the cable, a first member which is conductive and disposed inside and coupled to the contact pin, a second member disposed outside and coupled to the contact pin, and a third member which is conductive and disposed outside the second member. Here, the contact pin includes a first body coupled to the second member, a first contact portion which is conductive and extends from one side of the first body to come into contact with the signal pin, and a second contact portion which extends from the other side of the first body and comes into contact with an object being tested. The third member includes a second body coupled to the second member and a third contact portion.

Cable adaptor

A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

MEMS film for semiconductor device test socket including MEMS bump

An inspecting method using an electro-optical detecting device is disclosed. The electro-optical detecting device includes: an upper substrate and a lower substrate; a nematic liquid crystal layer interposed between the upper substrate and the lower substrate; a transparent electrode interposed between the nematic liquid crystal layer and the upper substrate, the transparent electrode connected to a device under test (DUT) via a power supply; a polarizing plate located over the nematic liquid crystal layer; and a reflecting plate located under the nematic liquid crystal layer. A method using the electro-optical detecting device includes applying a voltage between the transparent electrode and the DUT to generate an electric field across the liquid crystal layer; illuminating the detector and capturing an image of the detector using the light reflected from the detector; and determining the DUT has some defects from the image of the detector by an abnormal electric field generated between the transparent electrode and the DUT.

Inspecting method using an electro optical detector

Growing community of inventors

Gyeonggi-do, South Korea

Jin Kook Jun