Texas Instruments Corporation

Jin Keong Lim

Anis Fauzi Bin Abdul Aziz

Sueann Wei Fen Lim

Lee Han Meng@Eugene Lee

Lee Han Meng Eugene Lee

Mohamed Ashraf Mohd Arshad

A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

Spring bar leadframe, method and packaged electronic device with zero draft angle

A molded system () has a plurality of components () attached to a carrier (), one of the components being an object () of irregular thermal capacitance. For example, carrier () may be a QFN/SON-type leadframe and object () an inductor of high thermal capacitance. The surface of the object is sealed with a hardened polymeric layer () of high thermal resistance, whereby the layer () thermally insulates the object () and inhibits the transport of thermal energy between the object and the system. System () has molding compound () encapsulating the carrier and the attached components including the object () and the polymeric layer sealing the object's surface.

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Kuala Lumpur, Malaysia

Jin Keong Lim