Samsung Electronics Co., Ltd.

Jin-Kee Choi

Dong-Gun Park

Cheol Mo Jeong

Tae Kyung Kim

Joon-Mo Kwon

Won Shik Lee

Hyeong-Chan Ko

Hong-Joon Moon

Min-Seok Ha

A semiconductor device with a load resistor is manufactured such that a contact is formed at both ends of the load resistor, and at least one contact is formed between the contacts, in order to prevent impurities from being generated within each contact while the contacts are being generated by etching an insulation layer phenomena of electric charge build up from occurring when an etching process fabricates an insulation layer to generate the contact in a long load resistor located under the insulation layer and insulated electrically and physically.

Semiconductor device with load resistor and fabrication method

Load resistor with dummy contact substantially free of charge build up during etching process

A method of preparing a semiconductor wafer includes the step of forming first and second layers of a first material on opposing respective first and second faces of the semiconductor wafer. The second layer of the first material is then removed from the second face of the semiconductor wafer. More particularly, the first material can be polysilicon. Warping of the semiconductor wafer can thus be reduced.

Wafer grooves for reducing semiconductor wafer warping

Methods including wafer grooves for reducing semiconductor wafer warping

Growing community of inventors

Seoul, South Korea

Jin-Kee Choi