Panasonic Intellectual Property Management Co., Ltd.

Jin Jin

Atsushi Yamaguchi

Daisuke Sasaki

Shigeru Yamatsu

Yasuo Fukuhara

Naoki Kanagawa

Kazuki Watanabe

An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa&#xb7;s or less at 140&#xb0; C.; a temperature of 150&#xb0; C. to 170&#xb0; C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20&#xb0; C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve.

Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor device

A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device

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Osaka, Japan

Jin Jin