Avago Technologies General IP (singapore) Pte. Ltd.

Jin Jeong

Chris Chung

Deog Soon Choi

William Lam

Tae Eun Kim

Young Ho Lee

Ashish Alawani

Nitesh Kumbhat

Hyun Mo Ku

Yong-Ik Choi

A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.

Module with internal wire fence shielding

A PCB includes a copper seed layer, a dielectric layer provided on the copper seed layer, a first thermal via and a plurality of second thermal vias disposed around the first thermal via. The first thermal via has a first through-hole in the dielectric layer and a first copper portion filled in the first through-hole, and each of the second thermal vias has a second through-hole in the dielectric layer and a second copper portion filled in the second through-hole. A mounting portion configured to mount a semiconductor device thereon is provided on the first copper portion.

Printed circuit board with thermal via

A bonding pad for use in attaching a semiconductor chip to a printed circuit board, includes: a copper layer; an organic layer disposed over the copper layer in a pattern such that part of the copper layer is exposed; and a gold layer disposed over the organic layer and in contact with the exposed part of the copper layer.

Bonding pad for printed circuit board and semiconductor chip package using same

An apparatus for inspecting a passive component having a signal transmission line on a printed circuit board (PCB), includes a reflectometry unit for inputting an incident signal to an input port connected to the signal transmission line, receiving a reflected signal in response to the incident signal, and computing a plurality of frequency-based reflection coefficient values in a preset frequency range and a plurality of time-based reflection coefficient values in a preset time range based on the incident signal and the reflected signal; and a defect detection unit for determining whether the signal transmission line has a defect based on the plurality of frequency-based reflection coefficient values, and determining a location of the defect on the signal transmission line based on the plurality of time-based reflection coefficient values.

Apparatus for inspecting passive component having signal transmission line

A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another.

Semiconductor device test socket

An electromagnetic interference blocking device is provided for blocking electromagnetic interference between transmission lines formed on a surface of a circuit board. The electromagnetic interference blocking device includes a body configured to be inserted into a slot formed in the surface of the circuit board between the transmission lines, the body including a bottom portion having a comb shape insertable within the slot.

Electromagnetic interference blocking device and circuit assembly including the same

A loading apparatus for loading a printed circuit board (PCB) stack including one or more PCB layers and transferring the PCB stack to an inspection probe includes a movable support unit, a guide unit and a cover. The guide unit is provided on the support unit and defines a depression portion in which the PCB stack is mounted. The cover is configured to cover the depression portion of the guide unit when closed, where the cover has multiple protrusions extending from a lower surface, which press the PCB stack into the depression portion when the cover is closed.

Growing community of inventors

Kyunggi province, South Korea

Jin Jeong