Lg Electronics Inc.

Jin Hyung Ryu

Sam Je Cho

Je Seok Kim

Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist. Accordingly, since the first substrate and the second substrate are formed of same material, the BGA package can be prevented from being cracked and being nonuniform when fired.

Semiconductor package and method of making a semiconductor package

The present invention relates to a plasma display panel, and more particularly, to a plasma display panel and method of manufacturing the same in which a manufacturing process is simple. To this end, in a plasma display panel according to an embodiment of the present invention, metal electrodes are composed of a green tape having a black electrode formed at the bottom and a silver electrode formed at the top, and are formed by exposing the green tape to ultraviolet rays of different wavelengths consecutively. Therefore, it is possible to simplify a manufacturing process of a plasma display panel and to reduce manufacturing cost.

Growing community of inventors

Bucheon-si, South Korea

Jin Hyung Ryu