Samsung Electro-mechanics Co., Ltd.

Jin Ho Hong

Youn Soo Kim

Hee Sung Choi

Hyun Sub Oh

Sa Yong Lee

Yong Il Kwon

Myung Sam Kang

Young Seuck Yoo

Sung Han Kim

Tae Hong Min

Jung Woo Choi

Sang Hyun Shin

Hong Kyu Shin

Eun Sil Kim

Jae Bum Cho

Keun Yong Lee

Yong Hyun Lee

Young June Lee

Il Jong Seo

Ye Eun Jeong

Oh Choon Kwon

A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.

Tantalum capacitor including conductive polymer layer having a filler

A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO, AlO, SiOand ZrO, and a coating film disposed on a surface of the core.

Tantalum capacitor

A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

Tantalum capacitor and manufacturing method thereof

A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35&#x2264;t2/t1&#x2264;0.9.

Solid electrolyte capacitor and fabrication method thereof

A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

Coil electronic component

There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.

Inductor and method of manufacturing the same

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Printed circuit board and method of manufacturing the same

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Suwon-si, South Korea

Jin Ho Hong