Samsung Medison Co., Ltd.

Jin Ho Gu

Gil-Ju Jin

Won Hee Lee

Dong Hyun Kim

Seong Jin Kim

Jae Woo Lee

Jae-Yk Kim

Gil Ju Jin

Sung Do Kwon

Jae Yk Kim

Jong Mok Lee

Yoonsung Kyung

Joong Hyun Park

Young Mun Cho

An ultrasonic probe for acquiring an ultrasonic image is provided. The ultrasonic probe includes a transducer generating an ultrasonic signal and including a lens provided to transmit the ultrasonic signal to the outside, a case accommodating the transducer and having an opening at one side so that the lens is brought into contact with an external target object, and a buffer member provided along a circumference of the transducer to protect the transducer from external impact and disposed between the case and the transducer.

Ultrasonic probe

Disclosed herein is a connector cover configured to be used in an ultrasonic probe connector and an ultrasonic probe assembly. The connector cover includes a case, and a coupling device disposed at one end portion in the case and configured to be coupled to the connector. The coupling device includes a body including a fastening portion configured to be coupled to a connector protrusion provided to protrude from the connector toward a first direction, and a rotating shaft connected to the case and the body, and the connector cover is configured to be coupled to the connector along a second direction.

Connector cover and ultrasonic probe assembly having the same

Disclosed herein is an ultrasonic probe having improved heat dissipation capability. The ultrasonic probe includes a housing, an acoustic module disposed in the housing, and configured to transmit an ultrasonic signal to an object and receive an signal reflected from the object, an electronic circuit disposed in the housing and electrically connected to the acoustic module to drive the acoustic module, and a hole communicating an outside of the housing with the electronic circuit so that the electronic circuit is cooled by air outside the housing.

An ultrasonic probe, a method for controlling the same, and an ultrasonic imaging apparatus including the same are disclosed. The ultrasonic probe includes a housing; a first contact sensing portion located at one position of an outer surface of the housing, and configured to detect contact; and a second contact sensing portion located at a different position from the first contact sensing portion, and configured to detect contact. A combination of contact sensing results obtained from the first contact sensing portion and the second contact sensing portion is determined such that an operation corresponding to the determined combination of the contact sensing results is carried out.

Ultrasonic probe, method for controlling the ultrasonic probe, and ultrasonic imaging apparatus including the ultrasonic probe

An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.

Ultrasonic probe apparatus and ultrasonic imaging apparatus using the same

Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.

An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.

Ultrasonic probe and method of manufacturing the same

Disclosed are an ultrasonic diagnostic instrument and a manufacturing method thereof. The ultrasonic diagnostic instrument includes a matching layer, at least one transducer provided at a lower surface of the matching layer to generate ultrasonic waves, a first acoustic absorption layer provided at a lower surface of the transducer to transmit an ultrasonic wave generation signal to the transducer, a controller provided at a lower surface of the first acoustic absorption layer to control operation of the transducer, the controller having a recess formed in a lower surface thereof, and a second acoustic absorption layer provided at a lower surface of the controller and having an insert formed at an upper surface thereof, the insert corresponding to the recess of the controller.

Growing community of inventors

Seongnam-si, South Korea

Jin Ho Gu