Skhynix Inc.

Hyundai Motor Company

Kia Motors Corporation

Hynix Semiconductor Inc.

Kia Corporation

Cheil Industries Inc.

Jin Ho Bae

Yong Sun Kim

Ki Jun Kim

Qwan Ho Chung

Seoung Hoon Lee

Han Sung Lee

Jong Hyun Nam

Woong Hee Lee

Han Jun Bae

Sung Ho Hyun

Tae Wook Chung

Ki Jin Kwon

Sang Min Jo

Myung Gun Park

Ki Young Kim

Seung Hyun Lee

Jong Hyun Kim

Seung Mok Lee

Jung Park

Dong Seon Uh

Jong Seob Kim

Chang Soo Woo

Bok Gyu Min

Il Hwan Cho

Sang Joon Lim

Beom Soo Kim

Joon Mo Park

Jong Woo Yoo

Hyun Hoo Sung

Sang Gyu Yoon

Kyu Yong Choi

Seong Kweon Ha

Jae Won Shin

Yu Jeong Choe

A foldable steering system for a vehicle may maximize spatial utilization of a driver seat by performing a fold-in operation in which a steering wheel, a steering shaft, shrouds, and the like are accommodated in a crash pad when an autonomous driving mode, a stopping mode, or a getting-in/out mode, in which a driver need not directly manipulate the steering wheel, is selected as a driving mode of an autonomous vehicle and configured for ensuring convenience of use and safety of the steering wheel by performing a fold-out operation in which the steering wheel, the steering shaft, the shrouds, and the like extend from an interior of the crash pad toward the driver seat when the driving mode of the autonomous vehicle is switched to a manual driving mode, an autonomous driving fail mode, and an active safety mode for coping with collision avoidance impossibility.

Foldable steering system for vehicle

A device may include a substrate having a first surface and a second surface, a first conductive terminal disposed over the first surface, a second conductive terminal spaced apart from the first conductive terminal in a first direction and disposed over the first surface, a first conductive auxiliary pattern disposed below the first conductive terminal and overlapping with the first conductive terminal, the first conductive auxiliary pattern being coupled to the second conductive terminal, and a second conductive auxiliary pattern disposed below the second conductive terminal and overlapping with the second conducive terminal, the second conductive auxiliary pattern being coupled to the first conductive terminal.

Semiconductor module including a printed circuit board

A motor-driven steering column device for a vehicle, the motor-driven steering column device may include a housing fixed to a vehicle body and having a pipe through one side portion of which a slot is formed; a telescopic pipe inserted into an internal diameter portion of the housing to be movable back and forth and locked and fastened to a steering shaft; a telescopic bracket disposed on an internal diameter portion of the telescopic pipe; and a driving device coupling the telescopic pipe and the telescopic bracket through the slot and providing power of moving back and forth to the telescopic pipe and the telescopic bracket.

Motor-driven steering column device for vehicle

A method for deploying an external air bag, including searching region of a front of vehicle, updating a physical amount of a searched object within the searching region each measurement period of a front sensor, determining a predicted physical amount each unit time during each measurement period, and predicting the physical amount by assuming that a specific searched object is moved at a constant speed when a capture of the specific searched object which was searched by the front sensor is stopped, selecting a target object among searched objects based on a relative speed or an overlap of the searched object obtained by the updating step or (Time To External Airbag) TTE and deploying the external air bag in a case in which each of a relative speed and an overlap predicted when the target object collides are a predetermined level or more.

Method for unfolding external air bag

A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

Semiconductor package and method for manufacturing the same

Disclosed herein is an external airbag deployment method. The method includes setting, by a controller, a detection area located in front. In addition, the method includes setting, by the controller, a target object from objects detected in the detection area, when an object has a relative velocity greater than a first reference, an overlap greater than a second reference, and a TTE less than a third reference, wherein TTE is a remaining time until the object collides with an airbag cushion when the external airbag is predicted to be deployed. Furthermore, the method includes determining, by the controller, whether a relative velocity and an overlap, predicted at a time when the target object is predicted to collide with the vehicle, are greater than predetermined levels and deploying the external airbag when the predicted relative velocity and overlap are greater than the predetermined levels.

External airbag deployment method and system

A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

Stack packages and methods of manufacturing the same

A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Stacked semiconductor package

In an external airbag deployment method, a detection area located in front of a vehicle is set. A target object is selected from among objects detected in the detection area by comparing relative velocities, overlaps, and Time To External Airbag (TTE) values of the detected objects. It is determined whether the vehicle is stable or unstable by comparing a predicted yaw rate of the vehicle with a measured yaw rate. It is determined whether a relative velocity and an overlap of the target object, predicted at a time when the target object is assumed to collide with the vehicle, are greater than predetermined levels. The external airbag is deployed if it is determined that the vehicle is stable and the predicted relative velocity and overlap of the target object are greater than predetermined levels.

External airbag deployment method

Disclosed herein is an external airbag deployment method of determining whether to deploy an external airbag. The method includes setting, by a controller, a detection area that has a predetermined range and tracking physical characteristics of objects entering the detection area. The detection area is a predetermined area located in front of a vehicle and is set by the controller based on a full deployment time of the external airbag and a relative velocity upon colliding with another object.

A horn switch device for a steering wheel may include an airbag module mounted in an inner region of the steering wheel to perform pressing and restoring operations while being elastically supported by a plurality of horn springs, a link plate assembly mounted on a lower surface of the airbag module and including a plurality of link plates to facilitate a seesaw movement, a module-side horn contact point positioned at the fixed end portion of each link plate and toward the outside of the airbag module, and a wheel-side horn contact point positioned below the module-side horn contact point. A horn operation is produced when the wheel-side horn contact point contacts with the module-side horn contact point.

Horn switch device for steering wheel

Disclosed is an external airbag apparatus. The apparatus includes, a back beam disposed on one surface directed toward a bumper on which an airbag module is disposed. The apparatus additionally includes a deployment guide disposed between the bumper and the back beam, both ends of which are coupled to the back beam, and a middle end of which is supported on the bumper. Furthermore, the apparatus includes a sensor disposed between the deployment guide and the back beam to sense impact when pressed by the deployment guide during impact to the bumper.

External airbag apparatus

A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an insulation member formed on the second surface of the semiconductor chip, and comprising a via hole at a position spaced apart from the semiconductor chip, and a conductive filler filling the via hole.

A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.

Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module

Growing community of inventors

Icheon-si, South Korea

Jin Ho Bae