Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Jin-Hee Park

Joo-Young Kim

Yong-Woo Lee

Sung-Kyu Shim

Sang-Hoon Lee

Bong-Hyun You

Joo-Woan Cho

Taek-Sun Shin

Kwang-wook Choi

Seong-Sik Choi

Jae-Chang Choi

Yong-Il Kim

Ju-Young Yoon

Kwan-ho Kim

Jae-Joong Kwon

Jeong-Geun Yoo

Young-Joo Park

Won-Ju Kim

Yong-Hwi Kim

Ho-Seok Son

Hoe-Woo You

Sung-Yeon Cho

Jae-Hyung Cho

Sun-Hyung Choi

Jae-Hyun Kim

Ji-Yoon Lee

Hyoung-Joo Kim

Jin-Ho Ha

Ji-Hye Kim

Jung-Tae Kang

Seung-Hwa Ha

Heu-Gon Kim

Hoon Shung Lee

Ja-Youn Lee

Jae-Sung Bae

Chi-O Cho

Jin-Oh Kwag

Byoung-Dae Ye

Hyun-Chul Bae

Tae-Seok Jang

Eun-Bi Kim

Seok-Won Kang

Ju-Ho Jeon

Hyuck-Joon Kwon

Kwang-Wook Choi

An electrostatic protection circuit with variable Schmitt trigger characteristics is provided. The electrostatic protection circuit uses a Schmitt trigger circuit to protect an integrated circuit against an overvoltage. The Schmitt trigger circuit includes first and second branches bridged between a power supply rail and a ground rail. The Schmitt trigger circuit operates with a narrow hysteresis width when the second branch is connected in parallel to the first branch and with a wide hysteresis width when the second branch is not connected in parallel to the first branch. The electrostatic protection circuit discharges an overvoltage of the power supply rail using a narrow hysteresis width when a weak overvoltage is applied to the power supply rail, and discharges an overvoltage of the power supply rail using a wide hysteresis width when a strong overvoltage is applied to the power supply rail.

Electrostatic discharge protection circuit having variable schmitt trigger characteristics

A display device may include a first touch sensing member on a top surface of a display panel, a second touch sensing member on a bottom surface of the display panel, a main FPCB coupled to the display panel and including first and second connecting portions, a first touch FPCB connected to the first touch sensing member and the first connecting portion, a second touch FPCB connected to the second touch sensing member and the second connecting portion, a first touch driving circuit on the first touch FPCB, and a second touch driving circuit on the second touch FPCB. The first touch driving circuit and the first connecting portion may be positioned opposite to each other with respect to the main FPCB. The second touch driving circuit and the second connecting portion may be positioned opposite to each other with respect to the main FPCB.

Touch sensitive display device

A rollable display device including a rollable display panel including a plurality of pixels each having an organic light emitting element, a panel driving circuit configured to drive the rollable display panel, a power supplying circuit configured to supply a high power voltage and a low power voltage to the rollable display panel, such that the organic light emitting element emits light based on the high power voltage and the low power voltage, and an ohmic drop compensation margin changing circuit configured to sense a degree that the rollable display panel is unrolled and change an ohmic drop compensation margin of the low power voltage to compensate ohmic drops based on the degree that the rollable display panel is unrolled.

Rollable display device and electronic device including the same

Display screen or portion thereof with graphical user interface

A backlight assembly includes a plurality of point light sources, a light guide plate ('LGP') and a printed circuit board ('PCB'). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.

Backlight assembly

Provided is a semiconductor memory device calibrating a termination resistance, the semiconductor memory device comprising self-adjustment logic configured to determine whether a value of an upper bit string of a calibration code generated in response to a calibration start signal is equal to or greater than an upper critical value of the calibration code, or is equal to or less than a lower critical value of the calibration code, and to generate an adjustment signal for adjusting a value of a termination resistance of a data output driver based on the determination result; and resistance calibration logic configured to provide the upper bit string to the self-adjustment logic, and to generate an updated calibration code by performing a calibration calculation based on the calibration code and a comparison signal generated according to a result of comparing a reference voltage and a voltage of a comparison target node.

Semiconductor memory device calibrating termination resistance and termination resistance calibration method thereof

A light emitting diode ('LED') backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards ('LED-PCBs') on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.

Liquid crystal display with light emitting diode backlight assembly and liquid crystal display thereof

A backlight assembly includes a light guide plate, a light source, a mold and a main frame. The light guide plate includes a first surface and a second surface extending from the first surface. The light source is disposed adjacent to the first surface of the light guide plate. The mold includes an upper portion, a lower portion and a side portion. The side portion connects to the upper and lower portions to form a receiving space, and the receiving space receives the light source and the first surface of the light guide plate. The main frame includes side walls and an upper wall extending from an upper portion of the side walls, and the mold is disposed in an opening below the upper wall.

Backlight assembly and display apparatus having the same

A display apparatus including an organic light emitting display including a terminal portion, a battery disposed on a surface of the organic light emitting display, and a flexible printed circuit board (PCB) bent to cover the organic light emitting display and the battery, a side of the flexible PCB being connected to the terminal portion and another side of the flexible PCB extending outside and attached to the battery.

Organic light emitting display comprising a battery and a flexible printed circuit board

A light-emitting module includes a light guide plate and a light source unit in accordance with an embodiment. The light guide plate include an upper surface, a lower surface facing the upper surface, a plurality of side surfaces connecting the upper surface and the lower surface, and a cross-sectional surface connected to at least one of the side surfaces. The light source unit includes a substrate disposed in correspondence with the cross-sectional surface and a point light source mounted on the substrate to emit light to the cross-sectional surface. Thus, light-emitting efficiency may be enhanced and the arrangement of point light sources may be optimized, so that a required amount of emitted light may be obtained using a small number of the point light sources. In addition, uniformity of luminance and heat-radiating efficiency may also be enhanced.

Light-emitting module and display device having the same

A backlight assembly includes a light source unit including a circuit board, a light source disposed on a first plane, of the circuit board, and at least one connection unit disposed on a second plane opposite to the first plane of the circuit board and electrically connected to the light source, a receiving container having a bottom plate and sidewalls extending from edges of the bottom plate and receiving the light source unit, the bottom plate including at least one opening portion in which the connection unit is inserted and exposed to the outside, and at least one driving unit disposed at a rear surface of the receiving container and connected to the connection unit for driving the light source unit.

Backlight assembly and method of assembling the same and liquid crystal display including backlight assembly

The light sourcing module of a backlit LCD display apparatus includes a light sources and power sources supporting substrate. The supporting substrate supports plural light sources on a top major surface thereof and at least one heat generating and power supplying circuit element that protrudes from a bottom major surface of the supporting substrate. The supporting substrate integrally includes wiring that couples driving power output by power supplying circuit element to the plural light sources. A rear receiving frame includes an integral heat-sinking and dissipating recess or groove that is positioned and dimensioned to receive the power supplying circuit element when the supporting substrate is received by the rear receiving frame. The integral heat-sinking and dissipating recess or groove removes heat from the heat generating and power supplying circuit element so that such heat does not adversely affect performance of the light sources.

Light source module and display apparatus having the same

A light emitting module includes a light emitting chip generating light, a case and a lead frame. The case includes a bottom plate and sidewalls connected to the bottom plate. The bottom plate and the sidewalls define a receiving space in which the light emitting chip is received. The light is emitted in a first direction through an opening portion opposite to the bottom plate. The lead frame includes an electrode portion disposed in the case, and electrically connected to the light emitting chip, a connecting portion extending from the electrode portion and disposed outside of the case, a mounted portion disposed adjacent to the connecting portion, and a buffering portion disposed between the connecting portion and the mounted portion. The buffering portion has a generally nonlinear shape protruding in a direction substantially perpendicular to the first direction.

Light emitting module and light providing assembly having the same

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Cheonan-si, South Korea

Jin-Hee Park