Skhynix Inc.

Hynix Semiconductor Inc.

Jin Hee Cho

Jong Sam Kim

Jung Yong Chae

Hoon Moo Choi

Min Su Park

Jae Il Kim

Tae Kyun Kim

Jin Youp Cha

Seung Geun Baek

Hui Kim

A semiconductor device may include a via hole, a first electrode, a second electrode and a first protecting insulation layer. The via hole may be formed to penetrate a substrate. The first electrode may include an electrode segment formed on a surface of the via hole. The second electrode may be formed on the first electrode along the surface of the via hole. The second electrode may include two ends that are positioned below a surface of the substrate. The first protecting insulation layer may be formed on the second electrode along the surface of the via hole. The first protecting insulation layer may include both ends that upwardly protrude from the both ends of the second electrode.

Semiconductor device including a through silicon via structure and method of fabricating the same

Recorder

A semiconductor device includes a group control circuit configured to generate a specified address and a control code in response to a row address and an active command, a comparison control signal generation circuit configured to generate a comparison control signal in response to the active command and a set code, and a target address generation circuit configured to output the specified address as a target address in response to the control code and the comparison control signal.

Semiconductor devices

Provided are a semiconductor device including an error correction code circuit and a driving method thereof. The semiconductor device includes a plurality of normal mats including a plurality of memory cells and connected to data lines, a plurality of dummy mats arranged in specific areas of the plurality of normal mats and inputting/outputting parity bits through parity lines of a specific circuit, a plurality of free ECC (Error Correction Code) calculation circuits that perform ECC calculation corresponding to data applied through the data lines and the parity lines, and a main ECC calculation circuit that combines data applied from the plurality of free ECC calculation circuits with one another and performs ECC calculation.

Semiconductor device and driving method thereof

A semiconductor apparatus includes a memory region; a fuse array including a plurality of fuse groups, each fuse group being configured to store a failed address of the memory region; a remaining-fuse information storage unit configured to store remaining-fuse information on a fuse group that includes a fuse corresponding to the failed address among the plurality of fuse groups; and a control unit configured to perform a control operation for updating the remaining-fuse information for the fuse group that includes a fuse corresponding to the failed address among the plurality of fuse groups and for storing the failed address when the failed address is detected.

Semiconductor apparatus and repair method thereof

A semiconductor apparatus includes a fuse array configured to store word line failure information, a redundancy latch section, and a redundancy control block configured to store, in the redundancy latch section, word line order information generated according to the word line failure information.

Semiconductor devices capable of a sensing margin of a semiconductor device are described. A semiconductor device may include a plurality of mats, a plurality of sensing circuits, a plurality of connecting circuits, and a plurality of mat dividing circuits. The mats are divided into upper regions and lower regions and activated by word lines. The sensing circuits are arranged in regions among the plurality of mats and are configured to sense/amplify data applied from the plurality of mats. The connecting circuits are configured to control connections between the mats and the sensing circuits in correspondence to a plurality of bit line selection signals. The mat dividing circuits are configured to selectively connect bit lines of the upper regions and the lower regions to each other in correspondence to a plurality of mat selection signals.

Semiconductor device with improved sense margin of sense amplifier

Various embodiments relate to a semiconductor device. The semiconductor device may include a plurality of mats configured to input and output the data of memory cells through a plurality of mat input/output lines. The semiconductor device may include a plurality of input/output lines coupled to the plurality of mat input/output lines and configured to input and output data. The semiconductor device may include mat control units disposed between the plurality of mats and configured to control the operations of the mats. The plurality of mat input/output lines may be grouped into a plurality of data line groups having the same characteristic, and some of the plurality of data line groups may be disposed to overlap with the mat control units.

Semiconductor memory device with input/output line

A semiconductor memory apparatus includes a reset pad configured to receive and transfer an external reset signal and an external control signal; a first input buffer configured to buffer the external reset signal in response to a buffer control signal and output an internal reset signal; a second input buffer configured to buffer the external control signal in response to the buffer control signal and output an internal control signal; and an input buffer control unit configured to generate the buffer control signal in response to an external command.

Semiconductor memory apparatus and method of operating using the same

A data output circuit according to one embodiment of the present invention includes: a delay control block configured to generate a clock delay signal in response to a power-up signal and a reset signal; a first delay block configured to correct a duty ratio of a rising clock according to the clock delay signal and output the corrected rising clock; and a second delay block configured to correct a duty ratio of a falling clock according to the clock delay signal and output the corrected falling clock.

Data output circuit

An output enable signal generation circuit includes an output enable reset signal generation unit configured to enable an output enable reset signal in response to an external clock signal, a DLL locking signal, and a reset signal, an output enable reset signal delay unit configured to delay the output enable reset signal and output the delayed output enable reset signal, a counter unit configured to output the count of the external clock signal as a value in response to the output enable reset signal and the delayed output enable reset signal, a read command delay unit configured to delay a read command and output the delayed read command, and an output enable signal output unit configured to shift the delayed read command in synchronization with a DLL clock signal and output an output enable signal, according to control of CL and the count value.

Growing community of inventors

Icheon-si, South Korea

Jin Hee Cho