Amkor Technology, Inc.

Samsung Electronics Co., Ltd.

Amkor Technology Singapore Holding Pte. Ltd.

Dongbu Hitek Co., Ltd.

Hyundai Motor Company

Sungkyunkwan University

Snu Rdb Foundation

Sang-A Frontec

S-Printing Solution Co., Ltd.

Jin Han Kim

Dong Jin Kim

Se Woong Cha

Yeong Beom Ko

Do Hyung Kim

Glenn A Rinne

Ji Hun Lee

Jae Hun Bae

Jin Young Kim

Jong Sik Paek

Dong Woo Lee

Jin Young Choi

Da Eun Kim

Joon Dong Kim

Won Myoung Ki

Seok-Mo Chang

Seung Eun Chung

Sung Chan Yun

Seungjae Lee

Doo Hyun Park

Hyun Soo Park

Curtis Michael Zwenger

Jun Hwan Park

Sungkyu Kim

Hyun Cho

Seung Nam Son

YoonJoo Kim

Dong Hoon Han

Won Chul Do

Keon Kuk

Sung Kyu Kim

Yoon Joo Kim

Woo Hyek Choi

Min Soo Kim

Seung Jae Lee

Choon Heung Lee

Dong Hoon Lee

No Sun Park

Il Ju Mun

In Sik Park

Byong Jin Kim

Il Han Park

Dae Hwan Kim

Gi Jeong Kim

Sang-Woo Kang

Jae Yun Kim

Jong Hyun Shin

Sun Jin Kim

Han Sol Seo

Tae Kyung Hwang

Seok Mo Chang

Sun Soo Kim

Young Dae Ko

Yong Soon Park

Bo-Hyung Cho

Pan Soo Kim

Jae Beum Shim

Paul Jang

Jun O Kim

Jin Chul Choi

Ji Hong Jung

Myung Ho Seo

Hyun Ji Yoon

Mi Ri Park

Hyun Woo Yu

Jong Man Choi

Kyoung Rock Kim

Hee-Soo Jeong

Won Chul Do Do

Jae Hun Bae Bae

Jin Seok Oh

Seung Oh Ko

Ii Ju Mun

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Package-on-package type semiconductor package

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Method of manufacturing a package-on-package type semiconductor package

A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

A dryer includes a main body, a drying chamber provided inside the main body and configured to accommodate objects to be dried, a conveying unit configured to convey the objects to be dried, a sensor unit configured to sense information on states of the objects to be dried, and a control unit configured to control the conveying unit to move the objects to be dried based on the information sensed by the sensor unit.

Dryer and control method thereof

A washing machine which performs a washing operation by heating water, a detergent, or a wash liquid using a dielectric heating method and a method of controlling the washing machine. The washing machine may include a water supply portion which supplies a wash liquid including water and a detergent, a power supply portion which supplies alternating current (AC) power, and an electric field forming portion which forms an electric field between a first electrode portion and a second electrode portion according to the AC power to heat the supplied wash liquid.

Washing machine and method of controlling the same

A source driver includes a buffer unit including a plurality of unit buffers corresponding to a plurality of source lines, where each of the plurality of unit buffers includes a plurality of input terminals and an output terminal connected to at least one of the plurality of source lines, and a decoder unit configured to receive image data and a plurality of gamma voltages, and input at least one of the plurality of gamma voltages to the plurality of input terminals of each of the plurality of unit buffers, using the image data. The decoder unit inputs two or more of the gamma voltages, having different magnitudes, to the plurality of input terminals of each of first unit buffers among the plurality of unit buffers, and the first unit buffers output a gradation voltage higher than a first voltage and lower than a second voltage.

Source driver using an interpolation method and display driver including the same

Provided are a dryer and method for controlling the same, which may appropriately and efficiently dry objects thrown into a receiving space by using high frequency electric fields and heated air. In accordance with one aspect of the present disclosure a dryer includes a main body, a drum rotationally placed inside the main body, a driver provides rotational force to the drum, an electrode part produces an electric field inside the drum, a power supplier supplies power to the electrode part, an air heater heats air, a blower supplies heated air into the drum and a controller controls the power supplier to block power supplied to the electrode part depending on a dried state of an object contained in the drum, controls the driver to rotate the drum, and controls the air heater and the blower to supply heated air into the drum.

Dryer and method for controlling the same

Growing community of inventors

Gyeonggi-do, South Korea

Jin Han Kim