Excelitas Technologies Singapore Pte. Ltd.

Excelitas Technologies Philippines Inc.

Excelitas Canada, Inc.

Jin Han Ju

Arthur John Barlow

Radu M Marinescu

Hermann Karagoezoglu

Grigore D Huminic

Jerry Deleon

Michael Ersoni

Fred Plotz

Robert Burman

A method includes forming a housing having a ceiling portion and a smoke permeable wall portion. The ceiling portion of the housing has a first aperture and a second aperture. The method includes mounting a circuit board to the housing so that the housing and the circuit board collectively define a smoke chamber that is bounded by the ceiling portion, the smoke permeable wall portion and the circuit board. The method includes placing an emitter in the first aperture and placing a detector in the second aperture. The emitter defines an emitting region in the smoke chamber and the detector defines a detecting region in the smoke chamber. In a typical implementation, the detecting region at least partially intersects the emitting region in the smoke chamber, and the emitter and the detector are disposed substantially outside the smoke chamber.

Integrated smoke cell

A device and method for manufacturing an integrated smoke cell are presented. The smoke cell includes an integral housing with a ceiling portion and a smoke permeable wall forming a chamber when mounted on a printed circuit board. An emitter and detector are mounted above apertures in the chamber ceiling so the emitter and detector are mounted substantially outside the chamber while detecting smoke present within the chamber without blocking ingress of smoke through the chamber wall.

A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.

Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Graphene-based thermopiles are provided. The graphene-based thermopiles may include thermocouples having one or more graphene strips that may be polarized to adjust their Seebeck coefficients. The polarized graphene strips may have larger Seebeck coefficients than the materials conventionally used in thermopile devices. As a result, the graphene-based thermopiles may generate large output voltages using fewer thermocouples than conventional thermopile devices.

Graphene-based thermopile

A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels formed by multiple thermopiles arranged on a single common shared support membrane. A separation between the edge of the shared support membrane and the outermost thermopile(s) may be included to provide additional thermal isolation between the thermopile and an underlying silicon substrate.

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Kirkland, Canada

Jin Han Ju