Lg Innotek Co., Ltd.

Jin Hak Lee

In Ho Jeong

Sang Young Lee

Jung Ho Hwang

Han Su Lee

Yun Mi Bae

Sang Hwa Kim

Soon Gyu Kwon

Dae Young Choi

Dong Hun Jeong

Kil Dong Son

Jae Hoon Jeon

Kyo Hun Koo

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Printed circuit board and method of fabricating the same

A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.

Circuit board comprising via

A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Printed circuit board and method of manufacturing the same

Method of manufacturing printed circuit board

A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein a width of a bottom surface of the surface treatment layer is narrower than a width of a top surface of the plating seed layer, wherein the bottom surface of the surface treatment layer includes: a first portion contacted with the circuit pattern layer; and a second portion non contacted with the circuit pattern layer, and wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer.

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.

Disclosed is a touch panel including a cover substrate including an active area and an inactive area, and a printing layer only on the inactive area. The printing layer includes a first printing layer, and a second printing layer to surround the first printing layer. The second printing layer includes a top surface making contact with the top surface of the first printing layer and a lateral side making contact with a lateral side of the first printing layer. The lateral side of the second printing layer has an average inclination angle in a range of about 1.5&#xb0; to about 2.7&#xb0; with respect to one surface of the cover substrate.

Growing community of inventors

Seoul, South Korea

Jin Hak Lee