Cheil Industries Inc.

Jin Gyu Park

Jung Bae Jun

Jae Ho Lee

Tae Sub Bae

Han Su Lee

Ju Sung Kim

Kyu Jeong Yeon

Hyun Jun Jeong

Sang Woon Lee

Hyun Soo Kim

Jung Il Park

Jae Geun Hong

Heung Se Lee

Dal Geun Kim

Jin Hee Um

Ik Hyeon Chang

Jin Hoo Lee

Kyung Tae Jung

Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles

Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same

Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Conductive particles for anisotropic conductive interconnection

One aspect of the invention relates to a method of preparing silicone fine particles which comprises preparing a mixture comprising an organotrialkoxysilane and an organochlorosilane to give a concentration of the organochlorosilane in the mixture of about 100 to about 2,000 ppm; mixing the mixture with water to prepare a sol solution; and maintaining a pH value of the sol solution within a range of about 8 to about 11. Another aspect of the invention relates to a thermoplastic resin composition which employs the silicone fine particles as a diffuser.

Silicone fine particles, method for preparing the same, and thermoplastic resin composition using the same

Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.

Polymer particles and conductive particles having enhanced conducting properties, and anisotropic conductive packaging materials containing the same

An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

Insulated conductive particles and anisotropic conductive adhesive film containing the particles

Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided. In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.

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Seoul, South Korea

Jin Gyu Park