Samsung Electronics Co., Ltd.

Jin Gyu Lee

Yi Yeol Lyu

Jin Heong Yim

Hyun Dam Jeong

Seok Mo Chang

Sang Kook Mah

Myung Dong Cho

Eun Ju Nah

Il Sun Hwang

Sang Hoon Joo

Jong Sung Yu

Ji Hun Rhee

Provided is a silica nanocomposite including silica and a siloxane-based polymer covalently bonded to the silica.

Silica nanocomposite, method of preparing the silica nanocomposite, composite foam and method of preparing the composite foam

The present invention relates to a method for preparing nanoporous carbons with enhanced mechanical strength and the nanoporous carbons prepared by the method, and more specifically, to a method for preparing a nanoporous carbon, comprising the steps of (i) synthesizing a mesoporous silica template not being subjected to any calcination process; (ii) incorporating a mixture of a monomer for addition polymerization and initiator, or a mixture of a monomer for condensation polymerization and acid catalyst into the as-synthesized mesoporous silica template, and reacting the mixture to obtain a polymer-silica composite; and (iii) carbonizing the polymer-silica composite at a high temperature to obtain a carbon-silica composite, from which the silica template is then removed using a solvent. According to the preparation method of the present invention, the nanoporous carbons having uniform size of mesopores, high surface area and high mechanical stability can be prepared at low preparation cost through a simplified preparation process. Therefore, the nanoporous carbons of the present invention can be used as catalysts, catalyst supports, separating agents, hydrogen reserving materials, adsorbents, membranes and membrane fillers in various application fields.

Method for preparing nanoporous carbons with enhanced mechanical strength and the nanoporous carbons prepared by the method

Disclosed herein is a siloxane-based resin prepared by hydrolyzing and polycondensing a cyclic siloxane compound, a silane compound having three hydrolysable functional groups and a silane compound having three hydrolysable functional groups and one heat-labile functional group, in an organic solvent in the presence of a catalyst and water. Also, disclosed herein is a method of forming an insulating film between interconnect layers of a semiconductor device using the siloxane-based resin thus prepared, whereby an insulating film having low dielectric constant as well as excellent mechanical properties can be obtained.

Siloxane-based resin and method of forming an insulating film between interconnect layers of a semiconductor device using the same

Method for forming insulating film between interconnect layers in microelectronic devices

Growing community of inventors

Seoul, South Korea

Jin Gyu Lee