Samsung Electro-mechanics Co., Ltd.

Skc Co., Ltd.

Jin Cheol Kim

Tae Kyoung Kim

Jun Rok Oh

Jong Hwi Park

Nah Young Kim

Hyun Gon Moon

Jonghak Choi

Min Soo Kim

Dong Gyu Lee

Il Hwan Yoo

Byung Kyu Jang

Hwa Young Lee

Sang-Jun Yoon

Hwa-Young Lee

Jun-Rok Oh

Geum-Hee Yun

Pyung Soo Ha

Sang Jun Yoon

Ho-Joon Park

Dongjin Park

Yu Jin Lee

Young-Ho Rho

Sung Jin Kim

Disclosed are a packaging substrate and a semiconductor device. The semiconductor device includes an element unit including a semiconductor element and a packaging substrate electrically connected to the element unit. By applying a glass substrate to the packaging substrate as a core substrate, connecting the semiconductor element and a motherboard can be closer to each other, so that electrical signals are transferred through as short a path, and significantly improved electrical properties such as a signal transfer rate could be achieved. Also, it is possible to prevent an occurrence of a parasitic element effect and to apply to a high-speed circuit device without additional insulating process.

Semiconductor device having a glass substrate core layer

An antenna device in which a conductive foil or an antenna pattern directly formed on the magnetic sheet without an insulating substrate such as polyimide, has a reduced thickness and may be prepared simple process. Also, with respect to the antenna device, flexibility may be improved by using a polymer-type magnetic sheet, and, since magnetic properties are excellent, the antenna device may be used for multiple applications such as NFC, WPC, and MST.

Antenna device and portable terminal comprising same

A magnetic sheet having improved acid/base-resistant properties, corrosion-resistance, and an excellent magnetic property at NFC, WPC, and MST frequencies, has little changes in weight and thickness even if the environment changes, for example, even after an etching treatment for patterning, or a reflow or soldering process which is performed for its application to a product.

Magnetic sheet and antenna device comprising same

According to a method of preparing a conductive magnetic composite sheet, the method comprising preparing a magnetic sheet comprising a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained stack to bond the magnetic sheet and the first conductive foil, a conductive magnetic composite sheet having excellent interlayer adhesion between the magnetic sheet and the conductive foil can be prepared while having an excellent magnetic property at NFC, WPC, and MST frequencies.

Method of preparing conductive magnetic composite sheet and antenna device

Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet.

Ceramic laminate sheet with flexibility and preparation method thereof

A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet.

Cut-out laminated sheet and preparation method thereof

A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

Capacitor embedded printed circuit board

Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Light emitting diode package and manufacturing method thereof

A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.

Method of manufacturing chip capacitor including ceramic/polymer composite

A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.

Method of manufacturing printed circuit board including embedded capacitors

Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from &#x2212;300 to +300 ppm/&#xb0; C. in the temperature range of &#x2212;55&#x2dc;125&#xb0; C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Insulating material for printed circuit board

The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

Growing community of inventors

Hwaseong-si, South Korea

Jin Cheol Kim