Semiconductor Manufacturing International (Shanghai) Corporation

Semiconductor Manufacturing International (Beijing) Corporation

Apexone Microelectronics Ltd.

Trustasia Technologies, Inc.

Jin Cheng

Fu Cheng Chen

Qijing Chen

Jianyong Hou

Lin Bo Shi

The present invention relates to an ACME centralized management system and a load balancing method thereof. The system is connected with an ACME client and a plurality of certificate authorities (CAs) respectively and comprises an ACME unloading module, and a statistics module, a strategy module, a verification module and a notification module which are connected with the ACME unloading module respectively. The ACME unloading module is in communication with the ACME client and the plurality of certificate authorities (CAs). Compared with the prior art, the present invention has the advantages of avoiding frequent verification, quickly issuing certificate copies, more efficiently issuing certificates, etc.

Acme centralized management system and load balancing method thereof

A wafer bonding method includes providing a first wafer including a first wafer surface, forming a first metal layer on the first wafer surface, and forming a first annular retaining wall structure including a first annular retaining wall and a second annular retaining wall surrounded by the first annular retaining wall. The first metal layer is formed between the first annular retaining wall and the second annular retaining wall. The method includes providing a second wafer including a second wafer surface, forming a second metal layer on the second wafer surface, and forming a second annular retaining wall structure including a third annular retaining wall and a fourth annular retaining wall surrounded by the third annular retaining wall. The second metal layer is formed between the third annular retaining wall and the fourth annular retaining wall. The method further includes bonding the first metal layer to the second metal layer.

Wafer bonding methods and wafer-bonded structures

The present invention discloses a switching amplifier and its modulations process, which belongs to the field of non-filters-type switching amplifier. The switching amplifier comprises: pulse-width modulation with dual comparator, multiple-loop feedback structure, only one integrating amplifier with dual-ends output needed for each loop, no less than two feedback loops set between the integrating amplifier and H-bridge, in addition, no any low-pass filters needed adding to the feedback path. Multiple feedback loops are adopted in the present invention, which can low the distortion of the switching amplifier to the extent. Furthermore, no any extra low-pass filters are needed adding to the feedback path, which making the products a higher cost effectiveness.

Switching amplifier and its modulation process

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Shanghai, China

Jin Cheng