Industrial Technology Research Institute

Jin-Bao Wu

Ming-Sheng Leu

Li-Duan Tsai

Jia-Jen Chang

Jenn-Yeu Hwang

Chih-Kuang Yu

Chun-Kai Liu

Jenn-Dong Hwang

Chun-Lung Li

Chih-Chao Shih

Chin-Te Shih

Ren-Jye Wu

Shih-Chun Tseng

Ping-Hsing Yang

Chao-Ying Chen

Wei-Chien Tsai

Hao-Wen Cheng

A grinding disk and a method of manufacturing the same are provided. The grinding disk includes a graphite base and a silicon carbide film, the silicon carbide film covering the graphite base, and the silicon carbide film has a surface grain size of 5 &#x3bc;m to 80 &#x3bc;m. By a hot-wall chemical vapor deposition system, a highly dense silicon carbide film is formed on a surface of the graphite base. The grinding disk may replace a conventional metallographic grinding and polishing disk, and is improved in characteristics such as hydrophobicity and abrasion resistance.

Grinding disk and method of manufacturing the same

A coated probe is provided. The probe includes a probe body and a cladding layer. The probe body has a terminal. The cladding layer covers the surface of the terminal of the probe body, wherein the cladding layer includes a carbon nano-material layer, and the carbon nano-material layer includes a carbon nano-material.

Coated probe and method of fabricating the same

A protected active metal electrode and a device with the electrode are provided. The protected active metal electrode includes an active metal substrate and a protection layer on a surface of the active metal substrate. The protection layer at least includes a metal thin film covering the surface of the active metal substrate and an electrically-conductive thin film covering a surface of the metal thin film. A material of the metal thin film is Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, or W. A material of the electrically-conductive thin film is selected from nitride of a metal in the metal thin film, carbide of a metal in the metal thin film, a diamond-like carbon (DLC), and a combination thereof.

Protected active metal electrode and device with the electrode

An apparatus for measuring thermal diffusivity includes a Raman spectroscope, a heating device, and a signal analyzing unit. The Raman spectroscope is utilized to measure a Raman scattering intensity of different sites of a film to be measured. The heating device is utilized to provide a controllable thermal driving wave. The signal analyzing unit is utilized to analyze the Raman scattering intensity from the Raman spectroscope and the thermal driving wave so as to evaluate the thermal diffusivity of the film to be measured.

Apparatus for measuring thermal diffusivity

A vacuum coating apparatus is disclosed. The apparatus includes a cathode target, a plurality of anodes, a transiting device, a pulsed arc discharge device, and a pulsed laser device. The plurality of anodes is placed on the transiting device and successively passes though a working position by the transiting device. The pulsed arc discharge device is electrically connected to the cathode target and the anode at the operable position to form plasma in a vacuum chamber for film coating. The pulsed laser device is located outside of the vacuum chamber and provides a pulsed laser beam onto the surface of the cathode surface to serve as a plasma trigger. A coating method for the vacuum coating apparatus is also disclosed.

Vacuum coating apparatus with mutiple anodes and film coating method using the same

A composite cathode foil is provided. The composite cathode foil includes an aluminum substrate, a metal layer formed thereon, a metal carbide layer formed on the metal layer, and a carbon layer formed on the metal carbide layer, wherein the metal of the metal layer is selected from the group consisting of IVB, VB and VIB groups. The invention also provides a solid electrolytic capacitor including the composite cathode foil.

Composite cathode foils and solid electrolytic capacitors comprising the same

Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.

Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same

A structural material of diamond like carbon (DLC) composite layers is provided. The structural material includes a composite material which is consisted of a metal layer, a first metal nitride layer, and a DLC thin film. The metal layer includes aluminum (Al), copper (Cu), zirconium (Zr), nickel (Ni), or vanadium (V). The first metal nitride layer includes aluminum nitride (Al&#x2014;N), zirconium nitride (Zr&#x2014;N), vanadium nitride (V&#x2014;N), or nickel nitride (Ni&#x2014;N). The DLC thin film of the structural material of DLC composite layers has high quality tetragonally bonded amorphous carbon (ta-C) with a sp(C&#x2014;C) bonding ratio of more than 30%. Therefore, it is suitable for the work pieces in the mechanical, chemical, electricity, photoelectric, and heat transfer fields.

Growing community of inventors

Hsinchu, Taiwan

Jin-Bao Wu