Advanpack Solutions Pte Ltd.

Advanced Systems Automation Limited

Jimmy Hwee Seng Chew

Kim Hwee Tan

Kok Yeow Lim

Fulin Liu

A water jet handler () has a loading location (), a cutting location (), and an unloading location (); and two movable mounts (and a). As a first movable mount () receives a molded substrate at the loading location (), and transports it to the cutting location (), a second movable mount () transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location () to the unloading location (). As the molded substrate on the first movable mount () is cut in the X direction () by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount () on which it is cut in the Y direction () to produce singulated semiconductor packages, as the first movable mount () returns to the loading location (), when another molded substrate is loaded.

Handler for semiconductor singulation and method therefor

A predetermined amount of solder ( ) is deposited on the free ends of copper posts ( ) extending from die pads of a semiconductor die ( ). The solder ( ) is coated with flux ( ) and the semiconductor die ( ) is placed on a leadframe ( ) with the solder deposits ( ) abutting interconnect locations ( ) on inner lead portions ( ). When reflowed, the solder deposits ( ) melt and with the assistance of the flux ( ) forms solder interconnects between the free ends of the copper posts ( ) and the interconnect locations ( ). Due to the predetermined amount of solder ( ) deposited on the free ends of the copper posts ( ), the molten solder ( ) tends not to flow away from the interconnect location ( ). Thus, advantageously allowing a substantial portion of the solder deposit ( ) to remain at the interconnect locations ( ) to form solder interconnects.

Growing community of inventors

Singapore, Singapore

Jimmy Hwee Seng Chew