Advanced Semiconductor Engineering, Inc.

Jiming Li

Chun Chen Chen

Yuanhao Yu

Cheng Yuan Chen

Chien-Wen Tu

Chih-Cheng Lee

A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

Semiconductor packages and methods of manufacturing the same

A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A Sparameter of the connector is less than −20 dB.

Semiconductor device package and method of manufacturing the same

A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure includes a substrate, a chip and a dielectric structure. The substrate includes a first portion and a second portion surrounding the first portion. The second portion defines a cavity over the first portion. The chip includes a terminal on an upper surface of the chip. The dielectric structure fills the cavity and laterally encroaches over the upper surface of the chip. The dielectric structure is free from overlapping with the terminal of the chip.

Semiconductor package structure with dielectric structure covering upper surface of chip

A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than &#x2212;20 dB.

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Kaohsiung, Taiwan

Jiming Li