Honeywell International Inc.

Jim Yardley

Richard J Pommer

Glen E Roeters

Methods and apparatus are provided which decrease the amount of movement likely to occur during processing of a substrate. In particular, a horizontally supported dielectric panel is subjected to a series of processing steps during which the panel is heated, cooled, or maintained at a fixed temperature so as to a achieve a 2 to 1 reduction in material movement during subsequent processing. It is contemplated that application of the disclosed methods to a dielectric panel will be particularly beneficial when application is accomplished prior to laser drilling and sputtering the panel.

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Morristown, NJ, United States of America

Jim Yardley