Lam Research Corporation

Jim Vail

Mike Wallis

Oliver David Jones

A method of applying a fluid to a brush is provided. The method includes outputting a flow of fluid from a shaft to an area between the shaft and a distributor where the flow of fluid is restricted by the distributor to generate a uniform pressure buildup inside of the distributor. The method further includes delivering the fluid from the area through at least one opening in the distributor to an outer surface of the distributor where the outer surface of the distributor abuts an inner surface of a housing. The method additionally includes dispensing the fluid from between the outer surface of the distributor and the inner surface of the housing to an outer surface of the housing through at least one perforation in the housing, the housing being attached to a brush. The method also includes applying the fluid through the brush where the fluid is received from the outer surface of the housing. The uniform pressure buildup inside of the distributor enables the brush from end to end to receive an approximate equal amount of liquid.

Methods for applying fluid through a brush interflow distributor

A brush assembly includes a distributor having a slot matrix formed in an outer surface of the distributor, the slot matrix including a plurality of longitudinal slots intersecting a plurality of annular slots. The brush assembly further includes a housing having an inner surface abutting the outer surface of the distributor, a brush mounted on the housing and a shaft. During use, the flow of liquid from the shaft to the housing flows through the longitudinal slots and annular slots of the distributor. By appropriately selecting the dimensions and numbers of these slots, the flow of liquid from the shaft to the housing is readily redistributed. For example, the flow of liquid is redistributed to provide a greater amount of liquid to the ends of the brush than to the center of the brush.

Brush interflow distributor

A method and apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During unloading of the wafer after cleaning, the wafer is located vertically between the first and second brushes and on a pair of rollers. A finger tip located vertically above the region between the first and second brushes contacts an edge of the wafer and thus hold the wafer in the precise unloading position at which a wafer transfer robotic arm has been programmed to engage/disengage the wafer. Accordingly, the wafer is reliably and repeatedly engaged by the robotic arm.

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Santa Cruz, CA, United States of America

Jim Vail