Applied Materials, Inc.

Jim Kellogg Atkinson

Hui W Chen

Edwin Velazquez

Hung Chih Chen

Brian J Brown

Allen L D'Ambra

Jonathan Paul Domin

Clinton P Sakata

Jianshe Tang

Simon Yavelberg

Lakshmanan Karuppiah

Tomohiko Kitajima

David J Lischka

Gee Sun Hoey

David Datong Huo

Dan Zhang

Yufei Chen

Noel Manto

David P Alvarez

Yunshuang Ding

Andrew Liu

One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Drying environments for reducing substrate defects

In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning

A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Double sided buff module for post CMP cleaning

Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes are disclosed. An article such as an annular body may be formed by a compression molding technique. By including a patterned surface as part of an outer circumferential surface of the annular body, frictional contact between the annular body and the substrate may be enhanced as friction-reducing fluids associated with a wet chemical processes may be directed away from the desired friction contact area between the annular body and the substrate. In this manner, frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the effectively of the process.

Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes

A substrate gripper apparatus is provided. Substrate gripper apparatus includes a body, a first slide member moveable relative to the body, a first finger mounting member coupled to the first slide member, a first lower finger coupled to the first finger mounting member, and a first pivoting finger coupled to the first finger mounting member. First pivoting member may impose a force on a substrate due to gravity. Methods of operating the substrate gripper apparatus as well as other aspects are provided.

Substrate gripper apparatus and methods

In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.

High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods

Methods, apparatus, and systems are provided for detecting the presence of a substrate in a load cup. The invention includes a proximity sensor having a detection pad disposed below a contact surface of a load cup assembly and a target disposed on a lever member and adapted to move toward the detection pad when a substrate is placed on the lever member and adapted to move away from the detection pad when a substrate is removed from the lever member. Numerous additional aspects are disclosed.

Methods and apparatus for sensing a substrate in a load cup

The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

Methods and apparatus for pre-chemical mechanical planarization buffing module

The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.

Methods and apparatus for marangoni substrate drying using a vapor knife manifold

Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

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Los Gatos, CA, United States of America

Jim Kellogg Atkinson