Agilent Technologies, Inc.

Jim Clatterbaugh

Hassan Tanbakuchi

Eric R Ehlers

Matthew Richter

Michael B Whitener

Jerry Orr

Timothy Earl Shirley

Xiaohui Qin

Mathias Bonse

Bobby Y Wong

James P Stephens

Deji Akinwande

Robin Zinsmaster

A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.

Through-chip via interconnects for stacked integrated circuit structures

Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.

Electrical interconnection for high-frequency devices

An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.

Electrical interconnection for coaxial line to slab line structure including a bead ring

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Santa Rosa, CA, United States of America

Jim Clatterbaugh