Taiwan Semiconductor Manufacturing Comp. Ltd.

Jill Wang

Jong-I Mou

Andy Tsen

Ming-Yu Fan

Jo Fei Wang

Sunny Wu

Po-Feng Tsai

Wang Jo Fei

The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a first plurality of semiconductor wafers; determining a sampling rate to the first plurality of semiconductor wafers based on process quality; determining sampling fields and sampling points to the first plurality of semiconductor wafers; measuring a subset of the first plurality of semiconductor wafers according to the sampling rate, the sampling fields and the sampling points; modifying a second process according to the measuring; and applying the second process to a second plurality of semiconductor wafers.

Advanced process control with novel sampling policy

System and method for implementing wafer acceptance test ('WAT') advanced process control ('APC') are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.

System and method for implementing a wafer acceptance test ('WAT') advanced process control ('APC') with novel sampling policy and architecture

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Hsinchu, Taiwan

Jill Wang