Samsung Electronics Co., Ltd.

Jikho Song

Donghan Kim

Inho Choi

Mitsuo Umemoto

Jae Choon Kim

Ji-yong Park

Jeong-Kyu Ha

Woonbae Kim

Sungeun Jo

Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

Fingerprint sensor package and display apparatus including the same

A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.

Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same

A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.

Semiconductor package and method of fabricating the same

Growing community of inventors

Seoul, South Korea

Jikho Song