Samsung Electronics Co., Ltd.

Fine Semitech Corp.

Jikang Kim

Byungchul Yoo

Myungjun Kim

Jeonghwan Min

Kyoungchae Seo

Byunghoon Lee

Changyoung Jeong

Sungyong Cho

Jaehyuck Choi

Han-Shin Lee

Ikjun Kim

Jeongsu Yang

Donghoon Chung

An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.

Method of removing an adhesive for an EUV mask and method of reusing an EUV mask

A pellicle including a water-soluble adhesive and a photomask assembly including the pellicle are provided. A pellicle may include a membrane, a pellicle frame, and a water-soluble adhesive disposed on the pellicle frame. The water-soluble adhesive may be prepared by a mixture including a water-soluble acrylic adhesive material in an amount of about 40% to about 55% by weight of the mixture, water or a solution of water and alcohol in an amount of about 40% to about 55% by weight of the mixture, and an additive in an amount of about 1% to about 5% by weight of the mixture.

Pellicle including a water-soluble adhesive and photomask assembly including the pellicle

Growing community of inventors

Osan-si, South Korea

Jikang Kim