Samsung Electronics Co., Ltd.

Jik-Ho Song

Woo-Jae Kim

Young-Hoon Ro

Ga-Young Kim

Embodiments of the inventive aspect include a printed circuit board and a semiconductor package using the same. The semiconductor package includes a substrate having one or more connection pads, semiconductor chips mounted on the substrate, an underfill layer filling a region between the semiconductor chips and the substrate, and solder bumps electrically connecting the connection pads and the semiconductor chips in the underfill layer. The substrate includes void preventing patterns protruding on a top surface of the substrate under the underfill layer.

Printed circuit board and semiconductor package using the same

Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including the same. The PCB includes: a PCB body; a bottom metal layer at a bottom of the PCB body; and a top metal layer at a top of the PCB body, and the top metal layer includes: vias vertically connected to the PCB body; bump pads hexagonally aligned in a horizontal direction around the vias; and connection patterns connecting the vias to two or more of the bump pads. Accordingly, the number of bump pads in a unit area of the PCB may be increased.

Growing community of inventors

Seoul, South Korea

Jik-Ho Song