California Institute of Technology

Nanyang Technological University

Stmicroelectronics Asia Pacific Pte Limited

Jijie Zhou

Flavio Noca

Morteza Gharib

Xueren Zhang

Subodh Gautam Mhaisalkar

Elijah Bodhi Sansom

Tong Yan Tee

Shanzhong Wang

Valeriy Nosik

Sridhar Idapalapati

Zhi Yuan Shane Loo

Michael J Bronikowski

Zhong Chen

Anna Iwaniec

The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.

Method of forming an interconnect on a semiconductor substrate

A protection layer is coated or otherwise formed over the interconnect structure. The interconnect structure includes a metal line (such as top and bottom metal layers connected by a metal via) and a low-K material. The protection layer includes a vertically aligned dielectric or other material dispersed with carbon nanotubes. The protection layer could include one or multiple layers of carbon nanotubes, and the carbon nanotubes could have any suitable dispersion, alignment, and pattern in each layer of the protection layer. Among other things, the carbon nanotubes help to reduce or prevent damage to the interconnect structure, such as by reducing or preventing the collapse of the low-K material or delamination between the metal line and the low-K material.

Enhancing metal/low-K interconnect reliability using a protection layer

A fluid transport method and fluid transport device are disclosed. Nanoscale fibers disposed in a patterned configuration allow transport of a fluid in absence of an external power source. The device may include two or more fluid transport components having different fluid transport efficiencies. The components may be separated by additional fluid transport components, to control fluid flow.

Nanoscale wicking methods and devices

A method of assembling large numbers of nanoscale structures in pre-determined ways using fluids or capillary lithography to control the patterning and arrangement of the individual nanoscale objects and nanostructures formed in accordance with the inventive method are provided. In summary, the current method uses the controlled dispersion and evaporation of fluids to form controlled patterns of nanoscale objects or features anchored on a substrate, such as nanoscale fibers like carbon nanotubes.

Method for patterning large scale nano-fibrous surfaces using capillography

A hydro-elastic pumping system formed from an elastic tube element having attached end members with different hydroimpedance properties, wherein the elastic element is pinched with certain frequency and duty cycle to form asymmetric forces that pump fluid.

Hydroimpedance pump

Growing community of inventors

Singapore, Singapore

Jijie Zhou