Surface Technology, Inc.

Jijeesh Thottathil

Thomas S Lancsek

Michael David Feldstein

The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath.

Plating bath solutions

The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions or concentrates each usable to both make up an original bath and to replenishment of the original bath.

This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.

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Mercerville, NJ, United States of America

Jijeesh Thottathil