Industrial Technology Research Institute

Jiin-Shing Perng

Min-Lin Lee

Shinn-Juh Lai

Huey-Ru Chang

Sheng-Che Hung

The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.

Power device package structure

A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.

Growing community of inventors

Hsinchu County, Taiwan

Jiin-Shing Perng